Group 1 Medical Ultrasonics
Group 2 Sensors, NDE & Industrial application
Group 3 Physical acoustics
Group 4 Micro-acoustics SAW, FBAR, MEMS
Group 5 Transducers and transducers material
Group 1: Medical Ultrasonics
Vice Chair
Lori Bridal
Univ. Pierre and Marie Curie, Paris, France
Members
Ayache Bouakaz, INSERM, France
Lori Bridal, University Pierre and Marie Curie, France
Charles A. Cain, University of Michigan, USA
Jean-Yves Chapelon, INSERM, France
Jeremy Dahl, Stanford University, USA
Paul A. Dayton, University North Carolina/NCSU, USA
Marvin Doyley, University of Rochester, USA
Nico de Jong, Erasmus Medical Centre, The Netherlands
Chris de Korte, Catholic University of Nijmegen, The Netherlands
Jan Dhooge, Catholic University of Leuven, Belgium
Emad Ebbini, University of Minnesota, USA
Stas Emelianov, Georgia Institute of Technology and Emory University School of Medicine, USA
Kathy Ferrara, University of California Davis, USA
Stuart Foster, University of Toronto, Canada
Steven Freear, University of Leeds, UK
Caterina Gallipi, University of North Carolina, USA
James Greenleaf, Mayo Clinic, USA
Christopher Hall, Philips Research, USA
Peter Hoskins, University of Edinburgh, UK
John Hossak, University of Virginia, USA
Kullervo Hynynen, University of Toronto, Canada
Jørgen Arendt Jensen, Technical University Denmark , Denmark
Hiroshi Kanai, Tohoku University, Japan
Jeff Ketterling, Riverside Research , USA
Michael Kolios, Ryerson University, Canada
Elisa Konofagou, Columbia University, USA
Nobuki Kudo, Hokkaido University, Japan
Roberto Lavarello, Pontificia Universidad Catolica, Peru
Pai-Chi Li, National Taiwan University, Taiwan
Hervé Liebgott, CREATIS, France
Jian-yu Lu, University of Toledo, USA
Tom Matula, University of Washington, USA
James G. Miller, Washington University, USA
Helen Mulvana, University of Glasgow, UK
Kathy Nightingale, Duke University, USA
Svetoslav Nikolov, BK Medical, Denmark
William D. O’Brien, University of Illinois, USA
Michael Oelze, University of Illinois, USA
Georg Schmitz, Ruhr-Universität Bochum, Germany
Ralf Seip, SonaCare Medical USA
Mickael Tanter, INSERM, France
Kai Thomenius, Massachusetts Institute of Technology, USA
Hans Torp, University of Science and Technology, Norway
Piero Tortoli, University Firenze, Italy
Ton van der Steen, Erasmus Medical Centre, The Netherlands
Mingxi Wan, Xi’an Jiaotong University, China
Kendall Waters, Silicon Valley Medical Instruments, USA
Keith Wear, Food and Drug Administration, USA
Wilko G. Wilkening, Siemens Medical Solutions , USA
Chih-Kuang Yeh, National Tsing Hua University, Taiwan
Alfred Yu, University of Waterloo, Canada
Hairong Zheng, Shenzhen Institutes of Advanced Technology, China
Group 2: Sensors, NDE, and Industrial Application
Vice Chair
Erdal Oruklu
Illinois Institute of Technology, USA
Co-chair
Mario Kupnik
Technische Universität Darmstadt, Germany
Members
Robert C. Addison, Rockwell Science Center, USA
Walter Arnold, Fraunhofer Institute for NDT, Germany
James Blackshire, Air Force Research Laboratory, USA
Ramazan Demirli, Villanova University, USA
James Friend,UCSD, USA
Eric S. Furgason, Purdue University, USA
David Greve, Carnegie Mellon University, USA
Edward Haeggstrom, University of Helsinki, Finland
Joel Harley, University of Utah, USA
Jacqueline Hines, Applied Sensor R&D Corporation, USA
Patrick Johnston, NASA Langley Research Center
Lawrence W. Kessler, Sonoscan Inc.
Pierre T. Khuri-Yakub, Stanford University
Mario Kupnik, Technische Universität Darmstadt
Roman Maev, University of Windsor
Donald McCann, Seadrill, USA
Kentaro Nakamura, Tokyo Institute of Technology, Japan
Erdal Oruklu, Illinois Institute of Technology, USA
Nishal Ramadas, Elster Instromet, Belgium – UK
Jafar Saniie, Illinois Institute of Technology, USA
Bernhard Tittman, Pennsylvania State University, USA
Jiromaru Tsujino, Kanazawa University, Japan
John F. Vetelino, University of Maine, USA
Paul Wilcox, University of Bristol, UK
William Wright, University College Cork, Ireland
Donald E. Yuhas, Industrial Measurement Systems, USA
Jennifer Michaels,Georgia Tech, USA
Group 3: Physical Acoustics
Vice Chair
Koen W.A. van Dongen
Delft University of Technology
Members
Arthur Ballato, Clemson University, USA
Anne Bernassau, Heriot Watt University, UK
Jan Brown, JB Consulting, USA
Charles Courtney, University of Bath, UK
Emmanuel Defay, CRP G. Lippmann, Luxemburg
Jiun Der Yu, Epson Research & Development Inc., USA
Jianke Du, Shanghai Jiaotong University, China
Dave Feld, Avago Technologies, USA
Takefumi Kanda, Okayama University, Japan
Kimmo Kokkonen, Aalto University, USA
Minoru Kuribayashi Kurosawa, Tokyo Institute of Technology, Japan
Amit Lal, Cornell University, USA
John Larson, Avago Technologies, USA
Vincent Laude, FEMTO-ST / CNRS, France
Andreas Mayer, Hochschule Offenburg, Germany
Farid Mitri, Chevron, USA
Roy H. Olsson, Sandia National Laboratories, USA
Mihir Patel, Schlumberger-Doll Research, USA
Yan Pennec, IEMN / Universite de Lille 1, France
Susan Schneider, Marquette University, USA
Bikash Sinha, Schlumberger-Doll Research, USA
Eun Sok Kim, University of Southern California, USA
Masaya Takasaki, Saitama University, Japan
Robert Thalhammer, Avago Technologies, Germany
Koen W.A. Van Dongen, Delft University of Technology, Netherlands
Jorg Wallaschek, Leibniz Universitat Hannover, Germany
Ji Wang, Ningbo University, China
Takahiko Yanagitani, Waseda University, Japan
Yook-Kong Yong, Rutgers University, USA
Group 4: Microacoustics – SAW, FBAR, MEMS
Vice Chair
Karl Wagner
TDK Corporation, Munich, Germany
Members
Ben Abbott, Qorvo Inc. , USA
Robert Aigner, Qorvo Inc. , USA
Sylvain Ballandras, freq ‘n’ sys SAS, France
Kushal Bhattacharjee, Qorvo Inc. , USA
Sunil Bhave, Cornell University, USA
Sergey Biryukov, IFW Dresden, Germany
Paul Bradley, Avago Technologies, USA
Jidong Dai, Murata Electronics, Inc., USA
Omar Elmazria, Universite de Lorraine, France
Gernot Fattinger, Qorvo Inc., USA
Gerhard Fischerauer, University of Bayreuth, Germany
Ken-ya Hashimoto, Chiba University, Japan
Shitang He, IACAS, China
Michio Kadota, Tohoku University, Japan
Jyrki Kaitila, Avago Technologies, Germany
Kimmo Kokkonen, Aalto University, Finland
Jan Kuypers, Qorvo Inc. , USA
Don Malocha, University of Central Florida, USA
Hiroyuki Nakamura, Skyworks-Panasonic Corp., Japan/USA
Natalya Naumenko, Nat. University of Science & Techology MISIS, Russia
Tuomas Pensala, VTT, Finland
Mauricio Pereira da Cunha, University of Maine, USA
Maximilian Pitschi, TDK Corporation, Germany
Leonard Reindl, Albert-Ludwigs-University Freiburg, Germany
Richard Ruby, Avago Technologies, USA
Marc Solal, Qorvo, Inc , USA
Shuji Tanaka, Tohoku University, Japan
Masanori Ueda, Taiyo Yuden, Japan
Karl Wagner, TDK Corporation, Germany
Robert Weigel, University of Erlangen-Nuremberg, Germany
Sergei Zhgoon, National Research University, Russia
Group 5: Transducers and Transducer Materials
Vice Chair
Sandy Cochran
University of Dundee, UK
Co-chair
Omer Oralkan
North Carolina State University, USA
Members
Sandy Cochran, University of Glasgow, UK
David Cowell, University of Leeds, UK
Christopher Daft, River Sonic Solutions, USA
Loriann Davidsen, Philips Healthcare, USA
Levent Degertekin, Georgia Institute of Technology, USA
Christine Démoré, University of Glasgow, UK
Charles Emery, Ulthera Inc., USA
Arif Sanli Ergun, TOBB University, Turkey
Lynn Ewart-Paine, NUWC, USA
Nicolas Felix, Vermon SA, France
Tomas Gomez, CSIC, Madrid, Spain
Anne-Christine Hladky, Institut Supérieur d’Electronique et du Numérique, France
Xiaoning Jiang, North Carolina State University, USA
Ho-yong Lee, Ceracomp Co., Ltd, Korea
Reinhard Lerch, Friedrich-Alexander-Universität Erlangen-Nuremberg, Germany
Richard O’Leary, University of Strathclyde, UK
Omer Oralkan, North Carolina State University, USA
Wei Ren, Xi’an Jiaotong University, China
Paul Reynolds, Siemens Healthcare, USA
Yongrae Roh, Kyungpook National University, Korea
Jean-Francois Saillant, Areva, France
Mark Schafer, Sonic Tech Inc., USA
Scott Smith, GE Global Research, USA
Wallace Smith, Office of Naval Research, USA
Yasuhito Takeuchi, Kagoshima University, Japan
Susan Trolier-McKinstry, Pennsylvania State University, USA
Jian Yuan, ALS Shanghai, China
Shujun Zhang, University of Wollongong, Australia
Qifa Zhou, University of Southern California, USA