May 15, 2018
The information explosion can be dealt with, using integration of very small photonic components on very high density Photonic Integrated Circuits (PICs).
The technological advancements in PICs have made them a popular choice for components of next generation networks. Silicon being the evident choice due to its high availability, mature fabrication technology, and low cost has attracted the researchers to explore the possibilities of integrating the fast photonics components on a chip. Due to robustness, flexibility, reliability and performance of PICs, many commercial solutions are now available for avariety of applications. In coming years, it is expected that the field will continue to advance and communicationnetworks may see a shift from electronic to all-optical/electro-optic network infrastructure.
Dr. Ghanshyam Singh, Associate Professor
Dep. of Electronics and Telecommunication Engineering
Malaviya National Institute of Technology Jaipur – MNIT
IEEE Photonics Society Distinguished Lecturer 2017-18
Politecnico di Torino – Maxwell Room – 15:00