November 2020
FAILURE MODE & EFFECTS ANALYSIS: THE NEW 7 STEP APPROACH!
Please note: The above times are Pacific times (this is an East Coast event that starts at 1 p.m. Eastern). FREE Webinar Failure Mode and Effects Analysis (FMEA) is an analytical methodology used to ensure that potential problems have been considered and addressed throughout the product and process development process. Part of the evaluation and analysis is the assessment of risk. FMEA is the most commonly used risk analysis method in the automotive and aerospace industries, and helps manufacturers and…
Find out more »Symposium on Reliability for Electronics and Photonics Packaging (IEEE- REPP).
Dates: Nov. 12-13, 2020 Location: Silicon Valley, CA, USA Abstract due date: September 15, 2020. The Symposium is driven by the Photonics and Reliability technical committees of EPS, and sponsored by the Santa Clara Valley IEEE Chapters of Reliability, Photonics, and Electronics Packaging. Due to the evolving nature of the pandemic, the delivery platform for the Symposium will be decided by the end of September 2020.
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