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The next IEEE SCV Rel chapter Co-sponsord event:
Symposium on Reliability for Electronics and Photonics Packaging
Reliability, Failure Modes and Testing for Integration of Electronics and Photonics (SiPho)
16-17 November, 2023 at SEMI World Hdqtrs, Milpitas, CA USA
Note: REPP-2023 is planned as a hybrid event, with both in-person and virtual participation via WebEx; make your choice during Registration.
Welcome to the fourth year of this new Symposium from the IEEE Electronics Packaging Society. This major Silicon Valley symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging in the context of heterogeneous integration. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses.
The intent is to bring together electrical, reliability, materials, mechanical, and computer engineers and applied scientists to address the state-of-the-art in all the interconnected fields of electronic and photonic packaging, with an emphasis on various reliability-related aspects: design-for-reliability, manufacturing, reliability modeling and accelerated testing.
Invited Plenary and Keynote Talks
| Reliability of Molded Packages under High Field Conditions Prof. Susanna Reggiani, Bologna Univ. |  | Reliability Challenges in Silicon-based MEMS Technologies Prof. Ashwin Seshia, Cambridge University |  |
| Reliability Assessment for Heterogeneously Integrated Packages Prof. Ganesh Subbarayan, Purdue University |  | SiPh Reliability and Qualification Angelo Miele, Cisco Systems Inc. |  |
| Test Processes for JEDEC-compatible Heterogeneous Packaging Technology for Integrated Photonics Sylwester Latkowski, Eindhoven University of Technology |  | Intelligent Reliability: IRel 4.0 Willem van Driel, Signify |  |
| Recent Advances in Electromigration and Theromomigration Study Prof. Xuejun Fan, Lamar University |  | Power Electronics Reliability Dr. Rene Poelma, Nexperia |  |
Topics of potential technical talks submitted for REPP-2023:
- 3D Hybrid Bonding Reliability
- Thermomechniacal Reliability of Memory Devices
- Reliability of Autonomous Vehicle (AV) Technology
- Hololens Reliability
- Reliability and Soft Error Rates in Telecom
- Electromigration in Nano-twinned Cu
- Reliability of Flex Electronics for AVs
- Reliability of Electronics for Electric and Hybrid-Electric Transportation Systems
- Mission Profile Generation and Assessment for Automotive Components
- Stressors from Multi-dimensional Mission Profiles for Semiconductor Reliability
- Reliability of 3D Stacked ICs
- Simulation of Thermal Fatigue Induced Voiding
- Reliability of 3D Integrated Power Devices
- Extended Lifetime Mission Profiles for Semiconductors
- Silicon Photonics Reliability
More information and to register: https://attend.ieee.org/repp
This meeting is open to all. You do not need to belong to the IEEE to attend this event; however, we welcome your consideration of IEEE membership as a career enhancing technical affiliation.