The next IEEE SCV Rel chapter Co-sponsord event:

Symposium on Reliability for Electronics and Photonics Packaging

Reliability, Failure Modes and Testing for Integration of Electronics and Photonics (SiPho)

16-17 November, 2023  at SEMI World Hdqtrs, Milpitas, CA USA

Note: REPP-2023 is planned as a hybrid event, with both in-person and virtual participation via WebEx; make your choice during Registration.

Welcome to the fourth year of this new Symposium from the IEEE Electronics Packaging Society. This major Silicon Valley symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging in the context of heterogeneous integration. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses.
The intent is to bring together electrical, reliability, materials, mechanical, and computer engineers and applied scientists to address the state-of-the-art in all the interconnected fields of electronic and photonic packaging, with an emphasis on various reliability-related aspects: design-for-reliability, manufacturing, reliability modeling and accelerated testing.

Invited Plenary and Keynote Talks

Reliability of Molded Packages under High Field Conditions
Prof. Susanna Reggiani, Bologna Univ.
Reliability Challenges in Silicon-based MEMS Technologies
Prof. Ashwin Seshia, Cambridge University
Reliability Assessment for Heterogeneously Integrated Packages
Prof. Ganesh Subbarayan, Purdue University
SiPh Reliability and Qualification
Angelo Miele, Cisco Systems Inc.
Test Processes for JEDEC-compatible Heterogeneous Packaging Technology for Integrated Photonics
Sylwester Latkowski, Eindhoven University of Technology
Intelligent Reliability: IRel 4.0
Willem van Driel, Signify
Recent Advances in Electromigration and Theromomigration Study
Prof. Xuejun Fan, Lamar University
Power Electronics Reliability
Dr. Rene Poelma, Nexperia

Topics of potential technical talks submitted for REPP-2023:

  • 3D Hybrid Bonding Reliability
  • Thermomechniacal Reliability of Memory Devices
  • Reliability of Autonomous Vehicle (AV) Technology
  • Hololens Reliability
  • Reliability and Soft Error Rates in Telecom
  • Electromigration in Nano-twinned Cu
  • Reliability of Flex Electronics for AVs
  • Reliability of Electronics for Electric and Hybrid-Electric Transportation Systems
  • Mission Profile Generation and Assessment for Automotive Components
  • Stressors from Multi-dimensional Mission Profiles for Semiconductor Reliability
  • Reliability of 3D Stacked ICs
  • Simulation of Thermal Fatigue Induced Voiding
  • Reliability of 3D Integrated Power Devices
  • Extended Lifetime Mission Profiles for Semiconductors
  • Silicon Photonics Reliability

More information and to register:  https://attend.ieee.org/repp

This meeting is open to all.  You do not need to belong to the IEEE to attend this event; however, we welcome your consideration of IEEE membership as a career enhancing technical affiliation.

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