SF Bay Area Nanotechnology Council


Archive for the ‘Events’ Category

Nov 12th, 2020: Online Symposium on Quantum Computing: Devices, Challenges and Applications

Wednesday, October 21st, 2020

IEEE SFBA Nanotechnology Council presents a symposium on Zoom! Join us for this one-day virtual conference!

When: Thurs Nov 12 – 8:30 AM to 5 PM Pacific Time (9am start)
$5 – with discounts available (Limited free tickets for Students and Unemployed/In-Transition/Retirees)

Online Event! Register HERE ! Registered attendees will receive an email with a link for the Zoom meeting

Quantum Computing: Devices, Challenges and Applications

The conference brings together leading researchers at the cutting edge of Quantum Computing technology from academia, government lab and industry. Topics covered will include various approaches to building quantum devices including superconducting Qbits (Google, IBM), adiabatic annealing (DWave\NASA Ames), and Quantum Photonic approaches such as defects in semiconductors and single atom Qubits using ultra cold atoms (Stanford\UC Berkeley).

Apart from discussions on different device approaches to harnessing information based on the interactions of light and electrons, the conference will also cover important computational challenges in this field. Topics covered will include designing effective quantum algorithms, quantum supremacy, scalability, quantum-inspire.We will strive to provide an effective forum for conference participants to network and actively engage with the speakers.

Our Lineup (with gratitude to our event sponsors!) :

Sept 15th, 2020: The Era of Hyperscaling in Electronics

Tuesday, September 1st, 2020

The Era of Hyperscaling in Electronics

Prof.  Suman Datta, Stinson Chair Professor of Nanotechnology, University of Notre Dame

Tues Sept 15, 11:30 AM – 1:30 PM : Online Check-in 11:30 AM – 12 Noon; Seminar 12 Noon – 1:30 PM

Online (Zoom) FREE Event! Register HERE


Heterogeneous Integration Fabric

In the past five decades, the semiconductor industry has gone through two distinct eras of scaling: the geometric (or classical) scaling era and the equivalent (or effective) scaling era. As transistor and memory features approach sub-10 nanometer, it is apparent that room for further scaling in the horizontal plane is running out. Further, the rise of data abundant computing is exacerbating the interconnect bottleneck that exists in conventional computing architecture between the compute cores and the memory blocks. In this talk, I will discuss how electronics is poised to enter a new, third, era of scaling – hyperscaling – in which resources are added in a flexible way when needed to meet the demands of data abundant workloads. This era will be driven by advances in embedded non-volatile memories, hybrid devices with merged logic and memory functionalities, monolithic three-dimensional integration, and heterogeneous integration techniques.


Suman Datta is the Stinson Chair Professor of Nanotechnology in Department of Electrical Engineering at the University of Notre Dame. Prior to that, he was a Professor of Electrical Engineering at The Pennsylvania State University, University Park, from 2007 to 2011. From 1999 till 2007, he was in the Advanced Transistor Group at Intel Corporation, Hillsboro, where he developed several generations of high-performance logic transistor technologies including high-k/metal gate, Tri-gate and non-silicon channel CMOS transistors. His research group focuses on emerging devices that enable new computing models. He is a recipient of the Intel Achievement Award (2003), the Intel Logic Technology Quality Award (2002), the Penn State Engineering Alumni Association (PSEAS) Outstanding Research Award (2012), the SEMI Award for North America (2012), IEEE Device Research Conference Best Paper Award (2010, 2011) and the PSEAS Premier Research Award (2015).  He is a Fellow of IEEE and the National Academy of Inventors (NAI). He has published over 350 journal and refereed conference papers and holds 185 patents related to semiconductors. He is the Director of a multi-university advanced microelectronics research center, called the ASCENT, funded by the Semiconductor Research Corporation (SRC) and the Defense Advanced Research Projects Agency (DARPA). He will serve as the General Chair of the 2020 IEEE International Electron Device Meeting (IEDM).

August 6th, 2020: All-Printed Supercapacitors for In Space Manufacturing and Terrestrial Applications

Tuesday, July 28th, 2020

All-Printed Supercapacitors for In Space Manufacturing and Terrestrial Applications

Dr. Myeonglok Seol, NASA Ames Research Center

Aug 6, 2020, 11:30 AM – 1:30 PM : Online Check-in 11:30 AM – 12 Noon; Seminar 12 Noon – 1:30 PM

Online (Zoom) FREE Event! Register  Here!


Printing technology has evolved from traditional quick writing tools to the modern
manufacturing methods for functional devices and systems. The benefits of printing-based
manufacturing include less material waste, fast-turn around prototyping due to simple
design customization and wide substrate compatibility. In this presentation, all-printed
supercapacitors, where all the components are made by printing, are introduced. Because
the device is manufactured only by printing, the complexity of manufacturing facilities can
be minimized and the resource efficiency and versatility are maximized, which are
particularly important in places where the supply of material and human resources are
limited such as rural areas, environmental monitoring of nuclear sites and space exploration
missions. We have fabricated electrical double layer capacitors and pseudocapacitors, both
with high electrochemical performance and cyclic durability and the results will be discussed
in detail.


myeonglok seol speaker headshot

Myeonglok Seol is currently a Scientist at the Center for Nanotechnology at NASA Ames
Research Center. He received his PhD in Electrical Engineering from Korea Advanced
Institute of Science and Technology (KAIST) in 2016. His research focuses on energy
harvesting and storage devices, printed electronics, and nanotechnology-enabled devices.
He received Future Technology Leader Award from the Engineers’ Council in 2018 and the
2018 Mike Sargeant Career Achievement Award for Young Professionals from the Institute
of Engineering and Technology, IET (UK).

Relevant citations and links

M.-L. Seol et al., All-Printed In-Plane Supercapacitors by Sequential Additive Manufacturing Process, ACS Applied Energy Materials, 2020, 3, 4965-4973, https://pubs.acs.org/doi/abs/10.1021/acsaem.0c00510

[UPDATE – NOW VIRTUAL!] June 9th, 2020: Quantitative Plasmonic Sensing with Single-Chip Inkjet Dispense Surface Enhanced Raman Spectroscopy (ID-SERS)

Saturday, May 23rd, 2020

SFBA Nanotechnology Council is pleased to announce our first online seminar – and it’s free!

We’d also like to take a moment to appreciate our community – the Council has earned the 2019 IEEE Outstanding Chapter Santa Clara Valley, as well as the Nanotechnology Council Outstanding Chapter title worldwide. Please see the Awards page for details.  Thank you all for your support!

Now onto the talk!


Quantitative Plasmonic Sensing with Single-Chip Inkjet Dispense Surface Enhanced Raman Spectroscopy (ID-SERS)

Dr. Fausto D’Apuzzo, Optical Scientist, HP Labs

Tues June 9

Noon-1:30PM Pacific Time, Virtual Meeting via Zoom

Register Here ! (Note: FREE to attend, but limited to 100 attendees! Registration ends at 10AM Pacific Time June 2nd.)



In this talk, I will present our Laboratory work on highly-quantitative plasmonic sensing based on Surface Enhanced Raman Spectroscopy (SERS). I will first describe our nano-imprinted SERS substrate architecture and performance. Then I will show how inkjet dispensing can be used in conjunction with SERS to encode each sensor with a calibration pattern of microdroplets (~30 pico-liters), with the aim of locally calibrating sensor performance. This way, we demonstrate that Measurement Uncertainty of the SERS signal can be reduced below 2%, which to our knowledge, is a new record for plasmonic sensing platform. Furthermore, the use of inkjet dispensing in combination with Raman mapping improves assay throughput (100-fold) and reduces sample volume consumption (105-fold) in an automated and reproducible fashion. Since this approach overcomes important practical hurdles, we believe that this work reignites interest in the potential commercialization of plasmonic-based chemical sensors.

Recent paper for reference:  A Generalizable Single-Chip Calibration Method for Highly Quantitative SERS via Inkjet Dispense.




Dr. Fausto D’Apuzzo is Optical Scientist at HP Labs, working on the Life Science team. His research interests are in optics systems, plasmonics and metamaterials for bio-sensing, with a focus on Surface Enhanced Raman Spectroscopy (SERS). He started investigating plasmonic systems since his master (2011) and PhD at the University of Rome “Sapienza”, before holding a postdoc position at L. Berkeley National Labs (LBNL) studying 2D plasmonic systems with Synchrotron Nano-Spectroscopy. He interned as an Optical Engineer at ACAMP (Alberta, Canada) before joining HP Labs (2018-present) where he is developing plasmonic sensing systems for quantitative chemical analysis.

February 5th, 2020: Light-based Rapid 3D Bioprinting for Precision Tissue Engineering and Regenerative Medicine

Wednesday, January 29th, 2020

For future events we are seeking suggestions for speakers and venues. We also welcome volunteers – please contact Vasuda Bhatia

3D Bioprinting and Nanoengineering Research at UC San Diego

Dr. Shaochen Chen – Chair of NanoEngineering and Professor of Bioengineering at UC San Diego

Register: Here

Wed Feb 5
11:30am: Networking & Pizza
Noon-1PM: Seminar
Cost: $4 to $6
Location: EAG Laboratories – 810 Kifer Road, Sunnyvale

In this talk, I will present our laboratory’s recent research efforts in rapid 3D bioprinting to create 3D tissue constructs using a variety of biomaterials and cells. These 3D biomaterials are functionalized with precise control of micro-architecture, mechanical (e.g. stiffness), chemical, and biological properties. Such functional biomaterials allow us to investigate cell-microenvironment interactions at nano- and micro-scales in response to integrated physical and chemical stimuli. From these fundamental studies we have been creating both in vitro and in vivo precision tissues for tissue regeneration, disease modeling, and drug discovery. To vascularize these engineered tissues, we have also developed a prevascularization technique by using the rapid 3D bioprinting method. Multiple cell types mimicking the native vascular cell composition were encapsulated directly into hydrogels with precisely controlled distribution.
As the Chair of the NanoEngineering Department, I will also discuss several cutting-edge research areas by our outstanding faculty.

For more information visit http://nanoengineering.ucsd.edu/



     Dr. Shaochen Chen is a Professor and Chair in the NanoEngineering Department and Professor in the Bioengineering Department at the University of California, San Diego (UCSD). He is the founding co-director of the Biomaterials and Tissue Engineering Center at UCSD. Before joining UCSD, Dr. Chen had been a Professor and a Henderson Centennial Endowed Faculty Fellow in Engineering at the University of Texas at Austin from 2001 to 2010. Between 2008 and 2010, he served as the Program Director for the Nanomanufacturing Program of the National Science Foundation (NSF). Dr. Chen’s primary research interests include: 3D printing and bioprinting, biomaterials and nanomaterials, stem cell and regenerative medicine, tissue engineering. He has published over 140 papers in top journals. Among his numerous awards, Dr. Chen received the NSF CAREER award, ONR Young Investigator award, and NIH Edward Nagy New Investigator Award. He also received the Milton C. Shaw Manufacturing Research Medal from ASME for his seminal work in 3D printing, bioprinting, and nanomanufacturing. Dr. Chen is a Fellow of AAAS, AIMBE, ASME, SPIE, and ISNM.


Dec 10th, 2019: Championing Science – Communicating Your Ideas to Decision Makers

Monday, November 11th, 2019

Championing Science – Communicating Your Ideas to Decision Makers

Dr. Roger Aines, Chief Scientist of the Energy Program at Lawrence Livermore National Laboratory
Amy Aines, Founder and CEO of Damianakes Communications

Register: Here

Tues Dec 10
11:30am: Networking & Pizza
Noon-1PM: Seminar
Cost: $4 to $6
Location: EAG Laboratories – 810 Kifer Road, Sunnyvale

book cover

Innovation and breakthrough approaches that benefit humanity start with an idea. Your ability to advance your ideas depends in part on whether you can convince decision makers and cross-disciplinary team members to support the work. Yet communicating to non-expert funders, managers or colleagues is often where technologists fail.
Amy and Roger Aines reveal why, and what can be done to change the outcome. In this talk, they will share insights and strategies from their research for writing Championing Science – Communicating Your Ideas to Decision Makers. They will explain how engineers can leverage skills in research, observation, experimentation, and the influence process, to make sure their ideas are heard.

For more information visit www.championingscience.com

   For the past 15 years, Dr. Roger Aines has been building coalitions around the globe to develop climate and energy technologies for a more livable planet. He is the Chief Scientist of the Energy Program at Lawrence Livermore National Laboratory where he leads a major Carbon Initiative to understand, develop, and implement technologies for the removal and reuse of carbon dioxide from the atmosphere. Since he joined the lab in 1984, Roger’s work has spanned nuclear waste disposal, environmental remediation, applying stochastic methods to inversion and data fusion, managing carbon emissions and sequestration monitoring and verification methods.   Roger graduated from Carleton College with his degree in chemistry and received his PhD in geochemistry from Cal Tech. He holds 24 patents and has authored more than 100 publications.
Roger is a sought after speaker who has delivered and endured countless scientific presentations. His guidance has enabled hundreds of fellow scientists to secure millions in research funding and gain broad support for their ideas. With Amy Aines he authored Championing Science – Communicating Your Ideas to Decision Makers, a comprehensive book to teach scientists essential communication, influence and relationship-building skills to advance their work.

     Amy Aines is founder and CEO of Damianakes Communications and co-author of Championing Science – Communicating Your Ideas to Decision Makers. A messaging strategist, speaker coach and reputation builder, Amy believes “Words Matter.” She honed her skills directing corporate and public policy communications for global telecommunications, technology and mobile phone companies for the first 20 years of her career.
Since she launched her consulting firm in 1999, Amy has helped hundreds of technical experts get audiences to listen and take action; building support for new ideas. Her work has contributed to the success of a multitude of products and programs at startups and global giants in the biotech, healthcare, telecommunications and technology sectors. These days she lectures, coaches and leads workshops to help grad students, postdocs and STEM career professionals learn to communicate with impact.



Oct 15th, 2019: Industrial Applications of EBSD (Electron backscatter diffraction) and ECCI (Electron channeling contrast imaging)

Monday, October 14th, 2019

Industrial Applications of EBSD (Electron backscatter diffraction) and ECCI (Electron channeling contrast imaging)

Dr. Jingyi Zhang, EBSD Scientist at EAG Laboratories

Register: Here

Tues Oct 15
11:30am: Networking & Pizza
Noon-1PM: Seminar
Cost: $4 to $6
Location: EAG Laboratories – 810 Kifer Road, Sunnyvale

Electron backscattered diffraction (EBSD) is a rapidly developing technique in the material characterization field. The technique gives microstructure information in the meso-scale which includes grain size, crystal orientation, grain boundaries, dislocations, and phase identification that all contribute to the device performance and reliability. Typical components that benefit from the EBSD analysis includes bond pads, solder joints, thin wires and capacitors. Electron channeling contrast imaging (ECCI) is a derivative technique from EBSD that gives quantitively defect density measurement of single crystals. The scanning area is on the order of several tens to hundreds of micrometers making this measurement ideal for high quality crystals (defect density 108/cm2 to 105/cm2).

Dr. Jingyi Zhang 
is an EBSD Scientist at EAG Laboratories, which she joined in 2018 after completing a doctorate in Mechanical Engineering at Washington State University. Her thesis was on mechanical and microstructural characterization of friction welds of dissimilar aluminum alloys. Previously she had earned an MS in Materials Science and Engineering at Iowa State University, and a BS in Materials Science at Tianjin University.

Sept 19th, 2019: 4th Annual “Origin Stories” – Exploring Entrepreneurship

Monday, October 14th, 2019

4th Annual “Origin Stories” – Exploring Entrepreneurship
CEO/Founders discuss the technology and business aspects of building a successful company based on nanotechnology
Register: Here

Thurs Sept 19 – 5:30 PM to 9:40 PM
Early Registration: $11 to $17 – Light dinner included

Location: SEMI Global Headquarters
673 South Milpitas Boulevard, Milpitas

Presenting Companies include:

Gleb Yushin, Co-Founder and CTO, Sila Nanotechnology – silicon-dominant anode products that drop into existing battery manufacturing processes and deliver significantly higher energy density

Deepak Dugar, President and Founder, Visolis Biotechnology – displacing petroleum-derived material with engineered, bio-based alternatives

Peter Boyd
, President and Founder, Nano Hydrophobics – self-assembling non-stick coatings that reduce fouling in industrial equipment and improve energy efficiency

Ram Prasad Gandhiraman
, Founder and CEO, Space Foundry – A NASA spin off developing plasma jet based direct-write printing technology to enable next generation of printed electronics products and sensors

August 20th, 2019: Recent Progress in Carbon Nanotube Logic Technology

Monday, July 8th, 2019

Recent Progress in Carbon Nanotube Logic Technology

Rebecca Park, PhD Candidate, Stanford University

Registration: HERE

Please register on Eventbrite before 8 PM on August 19

Tues August 20 – 11:30am: Networking & Pizza; Noon-1PM: Seminar
Cost: $4 to $6
Location: EAG Laboratories – 810 Kifer Road, Sunnyvale


 Tremendous effort has been made in exploring novel channel materials to complement silicon for future nanometer-scaled transistors. Among the viable options, carbon nanotubes (CNTs) are a potential candidate due to their high mobility and injection velocity despite their ultra-thin body thickness of 1 to 2 nm. Although carbon nanotube field-effect transistors (CNFETs) enable high-performance and energy-efficient digital systems, there are challenges that have yet to be solved.

carbon nanotube logic technology

   In this talk, I will review the significant progress that has been made in recent years which has brought us closer to realizing the full benefits that the CNT technology promises.




 Rebecca Park received her B.S. from Cornell University in 2013 and is currently a Ph.D. candidate in Electrical Engineering at Stanford University, under the supervision of Professor H.-S. Philip Wong, co-advised by Professor Subhasish Mitra.

   Her current research interest is in the development of high-performance and energy-efficient nanoelectronics, in which she has focused on carbon nanotube-based FETs.

   Rebecca is a recipient of the Intel/SRCEA Masters Scholarship (2014-2016) and the Intel/SRCEA PhD Fellowship (2016-2019). Her internship experience includes working in the Science & Solutions team at IBM (2017 summer) and in the Flat Panel Displays team at Apple (2018 summer).


July 9th, 2019: Industry Assessment of Emerging 3D Memory Technology Landscape

Monday, July 8th, 2019

Industry Assessment of Emerging 3D Memory Technology Landscape
Prashant Majhi, Principal Engineer, Intel Corporation
Register: Here 

Tues July 9
4:15: Networking, Drinks
4:45: Seminar
Cost: Free
Location: Allen Center for Integrated Systems (CIS), Stanford University

This talk will highlight the primary challenges and opportunities in emerging memory technologies to replace existing mainstream (SRAM/DRAM/NAND) memory technology in the memory hierarchy.
In particular, an industry perspective of the various memory types (filamentary, interfacial, bulk) proposed for cross-point based 3D memory technologies will be presented and discussed.


Prashant Majhi is a Principal Engineer at Intel, involved in R&D of novel devices/materials/process technologies for the continued scaling of advanced CMOS and memory technologies.
He has driven many logic and memory technology development projects/programs through his 14 years at Intel (including his Intel assignment as Chief Technologist at SEMATECH) and 4 years at Philips Semiconductors (now NXP). He has (co)authored 250+ peer reviewed articles, holds 100+ patents, given 75+ invited talks, and co-advised 15+ PhD students from various universities.
He holds a PhD from Arizona State University and Bachelor of Technology from IIT Madras.