• Medical Ultrasonics
• Sensors, NDE & Industrial application
• Physical acoustics
• Micro-acoustics SAW, FBAR, MEMS
• Transducers and transducers material

Medical Ultrasonics

Vice-Chair: Alfred C. H. Yu, University of Waterloo, Canada

 

 

1. Mike Averkiou, University of Washington, USA
2. Mark Borden, University of Colorado Boulder, USA
3. Ayache Bouakaz, INSERM, France
4. Lori Bridal, University Pierre and Marie Curie, France
5. Matthew F. Bruce, University of Washington, USA
6. Charles A. Cain, University of Michigan, USA
7. Jean-Yves Chapelon, INSERM, France
8. Magnus Cinthio, Lund University, Sweden
9. Guy Cloutier, University of Montreal, Canada
10. Jeremy Dahl, Stanford University, USA
11. Paul A. Dayton, University North Carolina/NCSU, USA
12. Marvin Doyley, University of Rochester, USA
13. Nico de Jong, Erasmus Medical Centre, The Netherlands
14. Chris de Korte, Radboud University Medical, The Netherlands
15. Jan Dhooge, Catholic University of Leuven, Belgium
16. Emad Ebbini, University of Minnesota, USA
17. Stas Emelianov, Georgia Institute of Technology and Emory University School of Medicine, USA
18. Mostafa Fatemi, Mayo Clinic, USA
19. Kathy Ferrara, University of California Davis, USA
20. Stuart Foster, University of Toronto, Canada
21. Brian Fowlkes, University of Michigan, USA
22. Steven Freear, University of Leeds, UK
23. Caterina Gallippi, University of North Carolina, USA
24. Damien Garcia, CREATIS, France
25. James Greenleaf, Mayo Clinic, USA
26. Peter Hoskins, University of Edinburgh, UK
27. John Hossack, University of Virginia, USA
28. Kullervo Hynynen, University of Toronto, Canada
29. Jørgen Arendt Jensen, Technical University Denmark, Denmark
30. Hiroshi Kanai, Tohoku University, Japan
31. Jeff Ketterling, Riverside Research, USA
32. Kang Kim, University of Pittsburgh, USA
33. Michael Kolios, Ryerson University, Canada
34. Elisa Konofagou, Columbia University, USA
35. Nobuki Kudo, Hokkaido University, Japan
36. Roberto Lavarello, Pontificia Universidad Catolica, Peru
37. Pai-Chi Li, National Taiwan University, Taiwan
38. Hervé Liebgott, CREATIS, France
39. Thanasis Loupas, Philips Ultrasound, USA
40. Lasse Løvstakken, Norwegian University of Science and Technology, Norway
41. Jian-yu Lu, University of Toledo, USA
42. James G. Miller, Washington University in St. Louis, USA
43. Massimo Mischi, Einhoven University of Technology, The Netherlands
44. Larry Mo, GE Global Research, USA
45. Helen Mulvana, University of Glasgow, UK
46. Kathy Nightingale, Duke University, USA
47. Svetoslav Nikolov, BK Ultrasound, Denmark
48. William D. O’Brien, University of Illinois, USA
49. Michael Oelze, University of Illinois, USA
50. Georg Schmitz, Ruhr-Universitat Bochum, Germany
51. Ralf Seip, SonaCare Medical, USA
52. Mickael Tanter, INSERM, France
53. Kai E. Thomenius, Massachusetts Institute of Technology, USA
54. Hans Torp, University of Science and Technology, Norway
55. Piero Tortoli, University of Florence, Italy
56. Matthew W. Urban, Mayo Clinic, USA
57. Ton van der Steen, Erasmus Medical Centre, The Netherlands
58. Mingxi Wan, Xi’an Jiaotong University, China
59. Kendall Waters, Silicon Valley Medical Instruments, USA
60. Keith Wear, Food and Drug Administration, USA
61. Wilko G. Wilkening, Siemens Medical Solutions , USA
62. Chih-Kuang Yeh, National Tsing Hua University, Taiwan
63. Alfred Yu, University of Waterloo, Canada
64. Roger J. Zemp, University of Alberta, Canada
65. Hairong Zheng, Shenzhen Institutes of Advanced Technology, China

Sensors, NDE & Industrial application

Vice-Chair: Oruklu Erdal, Illinois Institute of Technology, USA

 

 

1. Robert C. Addison, Rockwell Science Center
2. Walter Arnold, Fraunhofer Institute for NDT, Germany
3. James Blackshire, Air Force Research Laboratory, USA
4. Ramazan Demirli, Villanova University, USA
5. James Friend,UCSD, USA
6. David Greve, Carnegie Mellon University, USA
7. Edward Haeggström, University of Helsinki, Finland
8. Joel Harley, University of Utah, USA
9. Jacqueline Hines, Applied Sensor R&D Corporation, USA
10. Patrick Johnston, NASA Langley Research Center
11. Lawrence W. Kessler, Sonoscan Inc.
12. Mario Kupnik, Technische Universität Darmstadt, Germany
13. Roman Maev, University of Windsor
14. Donald McCann, Seadrill, USA
15. Jennifer Michaels,Georgia Tech, USA
16. Kentaro Nakamura, Tokyo Institute of Technology, Japan
17. Erdal Oruklu, Illinois Institute of Technology, USA
18. Nishal Ramadas, Elster Instromet, Belgium, UK
19. Jafar Saniie, Illinois Institute of Technology, USA
20. Bernhard Tittman, Pennsylvania State University, USA
21. Jiromaru Tsujino, Kanagawa University, Japan
22. John F. Vetelino, University of Maine, USA
23. Paul Wilcox, University of Bristol, UK
24. William Wright, University College Cork, Ireland
25. Donald E. Yuhas, Industrial Measurement Systems, USA

 Physical acoustics

Vice Chair: Koen W.A. van Dongen, Delft University of Technology, Netherlands

 

 

1. Arthur Ballato, Clemson University, USA
2. Anne Bernassau, Heriot Watt University, UK
3. Jan Brown, JB Consulting, USA
4. Charles Courtney, University of Bath, UK
5. Jianke Du, Ningbo University, China
6. Dave Feld, Broadcom Ltd, USA
7. Yun Jing, North Carolina State University, USA
8. Takefumi Kanda, Okayama University, Japan
9. Eun Sok Kim, University of Southern California, USA
10. Kimmo Kokkonen, Qorvo, Germany
11. Minoru Kuribayashi Kurosawa, Tokyo Institute of Technology, Japan
12. Amit Lal, Cornell University, USA
13. John Larson, Broadcom Ltd, USA
14. Vincent Laude, FEMTO-ST / CNRS, France
15. Margaret Lucas, University of Glasgow Scotland, UK
16. Andreas Mayer, HS Offenburg – Univ. of Applied Sciences, Germany
17. Alex Maznev, MIT, USA
18. Robert J. McGough, MSU, USA
19. Farid Mitri, Chevron, USA
20. Mihir Patel, Schlumberger-Doll Research, USA
21. Yan Pennec, IEMN / Universite de Lille 1, France
22. Bikash Sinha, USA
23. Masaya Takasaki, Saitama University, Japan
24. Robert Thalhammer, Broadcom Ltd, Germany
25. Koen W.A. van Dongen, Delft University of Technology, Netherlands
26. István A. Veres, Qorvo Inc., USA
27. Jörg Wallaschek, Leibniz Universität Hannover, Germany
28. Ji Wang, Ningbo University, China
29. Takahiko Yanagitani, Waseda University, Japan
30. Yook-Kong Yong, Rutgers University, USA
31. Jiun-Der Yu, Qualcomm Technologies, Inc., USA

Micro-acoustics SAW, FBAR, MEMS

Vice Chair: Shuji Tanaka, Tohoku University, Japan

 

 

1. Sylvain Ballandras,frec|n|sys SASU, France
2. Sunil Bhave, Purdue University, USA
3. Sergey Biryukov, Leibniz Institute for Solid State and Materials Research, Germany
4. Paul Bradley, Broadcom Ltd, USA
5. Jidong Dai, Murata Electronics North America, Inc., USA
6. Omar Elmazria, Université de Lorraine, France
7. Gerhard Fischerauer, Universität Bayreuth, Germany
8. Amelie Hagelauer, University of Erlangen-Nuremberg, Germany
9. Tao Han, Shanghai Jiao Tong University, China
10. Ken-ya Hashimoto, Chiba University, Japan
11. Shogo Inoue, Qorvo,Inc, USA
12. Michio Kadota, Tohoku University, Japan
13. Jyrki Kaitila, Broadcom Ltd, Germany
14. Jan Kuypers, Qorvo,Inc, USA
15. Ryo Nakagawa, Murata Manufacturing Co., Ltd., Japan
16. Hiroyuki Nakamura, Skyworks Solutions, Inc., Japan
17. Natalya Naumenko, National University of Science and Technology “MISIS”, Russia
18. Tuomas Pensala, VTT Technical Research Centre of Finland, Finland
19. Mauricio Pereira da Cunha, University of Maine, USA
20. Maximilian Pitschi, RF360 Europe GmbH, Germany
21. Leonhard Reindl, Albert-Ludwigs-Universität Freiburg, Germany
22. Rich Ruby, Broadcom Ltd, USA
23. Marc Solal, Qorvo,Inc, USA
24. Shuji Tanaka, Tohoku University, Japan
25. Masanori Ueda, TAIYO YUDEN CO., LTD., JAPAN
26. Karl Wagner, RF360 Europe GmbH, Germany
27. Robert Weigel, University of Erlangen-Nuremberg, Germany
28. Ventsislav Yantchev, Chalmers University of Technology, USA
29. Sergei Zhgoon, National Research University “MPEI”, Russia

Transducers and transducers material

Vice Chair: Sandy Cochran, University of Glasgow, UK

 

 

1. Jeremy Brown, Dalhousie University, Halifax, Canada
2. Sandy Cochran, University of Glasgow, UK
3. David Cowell, University of Leeds, UK
4. Christopher Daft, River Sonic Solutions, USA
5. Loriann Davidsen, Philips Healthcare, USA
6. Christine Démoré, University of Glasgow, UK
7. Charles Emery, Ulthera Inc., USA
8. Arif Sanli Ergun, TOBB University, Turkey
9. Lynn Ewart-Paine, NUWC, USA
10. Nicolas Felix, Vermon SA, France
11. Tomas Gomez, CSIC, Madrid, Spain
12. Anne-Christine Hladky, Institut Supérieur d’Electronique et du Numérique, France
13. Xiaoning Jiang, North Carolina State University, USA
14. Valsala Kurusingal, Thales Australia, Australia
15. Ho-yong Lee, Ceracomp Co., Ltd, Korea
16. Richard O’Leary, University of Strathclyde, UK
17. Franck Levassort, Francois-Rabelais University of Tours, Tours, France
18. Omer Oralkan, North Carolina State University, USA
19. Weibao Qiu, Shenzhen Institutes of Advanced Technology, China
20. Wei Ren, Xi’an Jiaotong University, China
21. Yongrae Roh, Kyungpook National University, Korea
22. Stefan Rupitsch, University of Erlangen-Nuremberg, Germany
23. Jean-Francois Saillant, Areva, France
24. Alessandro Savoia, Universita degli Studi Roma Tre, Italy
25. Wallace Smith, Office of Naval Research, USA
26. Susan Trolier-McKinstry, Pennsylvania State University, USA
27. Jian Yuan, ALS Shanghai, China
28. Shujun Zhang, University of Wollongong, Australia
29. Qifa Zhou, University of Southern California, USA