The 2019 First International Symposium on Instrumentation, Control, Artificial Intelligence, and Robotics

Chulalongkorn University, Bangkok, Thailand
16-18 January 2019

Advisory Committee
Kosin Chamnongthai, KMUTT
Thanaruk Theeramunkong, SIIT
Witaya Wannasuphoprasit, CUOrganising Committee
General Chair
David Banjerdpongchai, CU

General Co-Chair
Waree Kongprawechnon, SIIT

Technical Program Chair
Chirdpong Deelertpaiboon, KMUTNB

Technical Program Co-Chair
Itthisek Nilkhamhang, SIIT

Special Session Chairs
Chowarit Mitsantisuk, KU
Kou Yamada, GU, Japan
Poogyeon Park, POSTECH, Korea

Publication Chairs
Sudchai Boonto, KMUTT
Peerayot Sanposh, KU

Information System Chair
Kitsuchart Pasupa, KMITL

Financial Chair
Benjamas Panomruttanarug, KMUTT

Registration Chair
Sumit Panaudomsup, KMITL

Sponsor and Exhibition Chairs
Jirasak Chanwutitum, KMUTNB
Diew Koolpiruck, KMUTT

Local Arrangement Chair
Jitkomut Songsiri, CU

Publicity Chairs
Amphawan Julsereewong, KMITL
Young Soo Suh, Ulsan, Korea

International Program Chairs
Lychek Keo, ITC, Cambodia
Avrin Nur Widiastuti, UGM, Indonesia
Vimontha Khieovongphachanh, NOUL, Laos
Hla Myo Tun, YTU, Myanmar
Tu An Thi Do, HUST, Vietnam
Sutthiphong Srigrarom, UGS, Singapore

General Secretary
Sungwan Boksuwan, KMITL

ICA-SYMP 2019 IEEE Conference Record Number #45470 is the first annual international symposium organized by Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI) Association, and co-organized by Artificial Intelligence Association of Thailand (AIAT) and Thailand Robotics Society (TRS). The conference aims to provide an international platform to present technological advances, launch new ideas and showcase research work in the field of instrumentation, robotics, automation, control, and artificial intelligence.


  • Instrumentation
  • Artificial Intelligence
  • Robotics
  • Automation
  • Control Theory
  • Control of Power Electronics
  • Control of Power and Energy Systems
  • Control Applications

Important dates:
Deadline for Submission of Full Papers : August 3, 2018  September 17, 2018
Notification of Acceptance: October 19, 2018
Deadline for Submission of Final Manuscripts: November 30, 2018
Deadline Early-bird Registration: November 30, 2018
Symposium schedule: January 16-18, 2019


Paper submission:

1) Authors are invited to submit original full papers in English. We accept two types of paper.

Regular papers: Papers 4 pages in standard IEEE two-column format only, reporting their original work and results, applications, and/or implementation in one or more of the listed areas. Accepted regular papers will be published in the proceedings and will be submitted for inclusion in the IEEE Xplore. Digital Library. Acceptance will be based on quality, relevance, and originality.

Position papers: Extended abstracts 2-4 pages in the conference format. It is provided for authors who want to present a timely review of research such as case study. The accepted position paper will be published in the proceedings but will NOT be included in the IEEE Xplore Digital Library

A maximum of two (2) additional pages are permitted at an extra charge (THB 1,000 per page (~ USD 31)).

2) Papers must be submitted only through the submission system of the conference website.

3) At least one author of each accepted paper MUST register and present the paper at the conference in order that the paper is to be included in the program.

TPC will provide a list of high quality 10% of overall papers and invite the authors to extend the paper and submit for Engineering Journal (EJ).  All reviews will be carried out by TPC on EJ system.

ASEAN Student Travel Grant Award (A-STGA)

This grant award aims to encourage students’ contribution from ASEAN nations and to support their accommodations during ICA-SYMP 2019. A-STGA candidate should be an undergraduate/graduate student (at the time of the application) outside Thailand in ASEAN that attends and presents his/her paper at ICA-SYMP 2019.

For more information about the conference, please contact us email


Organized by
Co-organized by
Technically co-sponsored by