Industry Assessment of Emerging 3D Memory Technology Landscape
Prashant Majhi, Principal Engineer, Intel Corporation
Register: Here 

Tues July 9
4:15: Networking, Drinks
4:45: Seminar
Cost: Free
Location: Allen Center for Integrated Systems (CIS), Stanford University

This talk will highlight the primary challenges and opportunities in emerging memory technologies to replace existing mainstream (SRAM/DRAM/NAND) memory technology in the memory hierarchy.
In particular, an industry perspective of the various memory types (filamentary, interfacial, bulk) proposed for cross-point based 3D memory technologies will be presented and discussed.

Prashant Majhi is a Principal Engineer at Intel, involved in R&D of novel devices/materials/process technologies for the continued scaling of advanced CMOS and memory technologies.
He has driven many logic and memory technology development projects/programs through his 14 years at Intel (including his Intel assignment as Chief Technologist at SEMATECH) and 4 years at Philips Semiconductors (now NXP). He has (co)authored 250+ peer reviewed articles, holds 100+ patents, given 75+ invited talks, and co-advised 15+ PhD students from various universities.
He holds a PhD from Arizona State University and Bachelor of Technology from IIT Madras.