When/Where: Friday 1 Nov 2024, 9:00 AM to 12:00 PM PDT

Registration: Link

Contact: hiuyung.wong at ieee.org

Speaker: Dr. Mukta Farooq of IBM

Abstract:

While silicon scaling has reached astonishing levels over the last half century, there has not been a corresponding level of scaling in electronic packaging technology. However, Artificial Intelligence (AI) architectures are now changing the landscape, increasingly moving us towards advanced packaging technology and Heterogeneous Integration (HI). What are these unique requirements of AI which are driving the need for HI? What are some of the unique challenges in semiconductor and packaging technologies that must be overcome to make this successful? This seminar will discuss key HI methods including interposers, fan out wafer level processing, silicon bridges, and 3D integration to see how they can be leveraged to achieve AI architectures.