CALL FOR PAPERS
2016 IEEE ANDESCON
Arequipa, October 19-21, 2016
IEEE ANDESCON is the largest technical event of the countries belonging to the Andean Council of IEEE, open to the world. The eighth edition 2016 IEEE ANDESCON will be held in the city of Arequipa in Peru. Arequipa is Cultural Heritage of Humanity (UNESCO) for its historical value and natural characteristics. It is located at 2335 m.a.s.l. in the valley of the Chili River, the climate is mild and relatively dry, and the temperature varies between 21°C and 10°C. The sun shines almost every day of the year. Arequipa is located to 900 km south Lima and 1 hour by plane. Its gastronomy is best quality and originality of its dishes satisfies all requirements.
2016 IEEE ANDESCON seeks to reflect the professional development, promoting the integration of professionals, researchers and industry in a context in which prevail technological innovations to seek the benefit of the community of the countries of the Andean Region, bringing together the most outstanding companies, industries, universities and professionals.
Topics: Computing, Electrical Engineering, Electronics and Communications. The topics of the conference are shown below but are not limited to them.
The official language of IEEE ANDESCON is English. Papers must be submitted in PDF and should be no longer than 4 pages, following the IEEE Conference format, available on:
Papers can be submitted using the Easychair System by accessing the following address:
Accepted technical and special session papers will appear in IEEEXplore Digital Library.
|Full paper submission deadline:||Jun 30th, 2016|
|EXTENDED Full paper submission deadline:||Jul 11th, 2016|
|Full paper notification of acceptance:||Aug 19th, 2016|
|Final manuscript submission deadline:||Sep 05th, 2016|
General Chair: José Durán-Talledo (email@example.com)
Program Chair: Carlos Silva-Cárdenas (firstname.lastname@example.org)
Information Contact: Avid Román-González (email@example.com)
Sponsored and Organized by: IEEE PERU SECTION
For detailed information on proposal and paper submission procedure, please refer to the conference website.