Abstract Mass redistribution due to electromigration (EM) and thermomigration (TM) has been known to cause phase separation, voids and hillocks formation, whisker growth and others in solder interconnects. The “interconnects” […]
About IEEE RS/EPS/EDS Singapore Chapter
The Chapter supports activities related to the Reliability Society (RS), Electronics Packaging Society (EPS), and Electron Devices Societies (EDS) of IEEE through Conferences, Technical talks and Workshops. The flagship conferences of Chapter are International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) and Electronics Packaging Technology Conference (EPTC). Chapter also supports student activities in Universities and Polytechnics.
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