Technical Talks

  • 1 August, 2017
  • MSE Meeting Room, NTU


Abstract Mass redistribution due to electromigration (EM) and thermomigration (TM) has been known to cause phase separation, voids and hillocks formation, whisker growth and others in solder interconnects. The “interconnects” reliability is challenged by the potential open and short failures as well as degradation of mechanical strength. This reliability issue is becoming more acute due […]

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