Upcoming Meeting Announcements
Modern Techniques for Accurate EMC and E3 Simulations of Full Devices and Full Platforms
Date: Tuesday, September 24th, 2024
Time: 5:30 PM: Networking, Dinner and Drinks (food and beverages provided)
7:00 PM: Presentation
Speaker: Tim McDonald, President, EMA (Ansys Technology Partner)
Location: Compliance Testing, 1724 S. Nevada Way, Mesa, AZ 85204
TECHNICAL PROGRAM
MODERN TECHNIQUES FOR ACCURATE EMC AND E3 SIMULATIONS OF FULL DEVICES AND FULL PLATFORMS
This presentation delves into cutting-edge simulation techniques for predicting electromagnetic compatibility (EMC) and electromagnetic effects (E3) in complex devices and platforms. We begin by exploring digital engineering trends that integrate mCAD, eCAD, and cable wiring designs, enabling comprehensive product analysis through hybrid simulation techniques. Next, we highlight the pivotal role of AI/ML, trained by simulations, in enhancing product design. Finally, we discuss the practical benefits of these modern techniques in accelerating product development and reducing overall costs.
SPEAKER BIOGRAPHY
Dr. Tim McDonald is President at EMA. EMA is a leading developer of technologies for engineering simulation. EMA’s engineering specialty is in applied electromagnetics. In this domain, EMA provides software and services to promote the design, certification, and performance of customers’ products.
EMA is the Ansys Technology Partner behind the Ansys Electronics Plus solutions of EMC Plus and Charge Plus.
Dr. McDonald holds a PhD in Applied Physics and Applied Math from Columbia University.
RSVP
RSVP: Click here to register on line. Please register no later than Friday, September 20th in order to ensure adequate seating and catering. Everyone is welcome to attend – you do not need to be an IEEE member – just interested in EMI/EMC.