IEEE Princeton Central Jersey Section

As a summer special event, Princeton ACM and IEEE Computer Society is sponsoring a “hands-on” event featuring the design of T-shirts using AI-generated images. Our presenter will be the artist Larry Ward, who will present and discuss examples of his T-shirt designs. He will then take attendees through the design process so that they can create their own T-shirt designs. Attendees are required to bring their own laptop computers capable of wirelessly connecting to the Internet. Pre-meeting download directions: - Participants should download the GIMP software package and the ImageMagick software package from the Internet to their computer in advance. Larry will walk everyone through the installation instructions. - Visit https://www.gimp.org/downloads to find the downloads of the GIMP distribution for Windows, macOS, and Linux. - Visit https://imagemagick.org/script/download.php to find the downloads of the ImageMagick distribution for Windows, macOS, and Linux. - You won’t be able to use an iPad, Android tablet, or a Chromebook for this event. This is a family-friendly event, but minors must be accompanied by a responsible adult to ensure that they will be well-behaved (i.e. totally quiet during the lecture). No pre-registration is needed. Note: This special summer meeting is at a NEW LOCATION – Montgomery Library. Parking: There is ample free parking at the Montgomery Library. Directions to Montgomery Library From Princeton, it is just off of US 206 – 5 miles north of Princeton - Take US 206 north from Princeton - Take the “Bridgepoint Rd. / Orchard Rd. / River Rd.” turnoff - Turn left to proceed on Orchard Rd. - Go 1/2 mile on Orchard Rd. turn right at Montgomery Library entrance Speaker(s): , Larry Ward Montgomery Library, 100 Community Dr., Skillman, New Jersey, United States, 08558

IEEE PCJS DL “Continuum Robots” by Prof. Dr. Burgner-Kahrs Thursday, September 19, 2024 6:45 PM | (UTC-04:00) Eastern Time (US & Canada) | 2 hrs (https://ieeemeetings.webex.com/ieeemeetings/j.php?MTID=m03cb0fad1bd1503b31762868a9340315) https://ieeemeetings.webex.com/ieeemeetings/j.php?MTID=m03cb0fad1bd1503b31762868a9340315 Meeting number: 2533 281 0850 Meeting password: 3ZRmzc Join from a video system or application Dial [email protected] You can also dial 173.243.2.68 and enter your meeting number. To dial from an IEEE Video Conference System: *1 2533 281 0850 Tap to join from a mobile device (attendees only) (tel:%2B1-415-655-0002,,*01*25332810850%23%23*01*) United States Toll (tel:1-855-282-6330,,*01*25332810850%23%23*01*) United States Toll Free Join by phone +1-415-655-0002 United States Toll 1-855-282-6330 United States Toll Free (https://ieeemeetings.webex.com/ieeemeetings/globalcallin.php?MTID=m2b8c7317161b7fa799935c3e92c41e57) | (https://cisco.com/go/tollfree-restrictions) (https://ieeemeetings.webex.com/ieeemeetings/j.php?MTID=mcff53e0218e53a1b3443447b741a56f7) to your calendar. (Cannot add from mobile devices.) Speaker(s): Prof. Dr. Burgner-Kahrs, Virtual: https://events.vtools.ieee.org/m/418861

The number of connected devices is expected to reach 500 billion by 2030, which is 59-times larger than the expected world population. Objects will become the dominant users of next-generation communications and sensing at untethered, wireline-like broadband performance, bandwidths, and throughputs. This sub-terahertz 6G communication and sensing will integrate security and intelligence. It will enable a 10x to 100x increase in peak data rates. FPGAs are well positioned to enable intelligent radios for 6G when coupled with high-performance chiplets incorporating RF circuits, data converters, and digital baseband circuits incorporating machine learning and security. This talk presents use of 2.5D and 3D heterogeneous integration of FPGAs with chiplets, leveraging Intel’s EMIB/Foveros technologies with focus on one emerging application driver: FPGA-based 6G sub-THz intelligent wireless systems. Nano-, micro-, and macro-3D heterogeneous integration is summarized, and previous research in 2.5D chiplet integration with FPGAs is leveraged to forge a path towards new 3D-FPGA based 6G platforms. Challenges in antenna, packaging, power delivery, system architecture design, thermals, and integrated design methodologies/tools are briefly outlined. Opportunities to standardize die-to-die interfaces for modular integration of internal and external circuit IPs are also discussed. Speaker(s): Dr Farhana Sheikh, Agenda: 8pm - 9pm EST : DL and Q/A Virtual: https://events.vtools.ieee.org/m/420965