packaging
IEEE Technical Talk – Overview of IC Packaging Concepts (Materials & Methods)
IEM Electronic Engineering Technical Division (eETD) collaborates with The Institute of Electrical and Electronics Engineers (IEEE) Penang Joint Chapter to organize a technical talk on Overview of IC Packaging Concepts… Read more
IEEE-IEM eETD Mini Colloquium
Organizer: IEEE Malaysia ED/MTT/SSC Penang Joint Chapter Co-organizer: Electronic Engineering Technical Division (eETD), The Institution of Engineers Malaysia Date: September 24, 2016 (Saturday) Venue: PSDC, 1 Jalan Sultan Azlan Shah,… Read more