interconnects
IEEE Technical Talk – Nanocarbon Interconnects: from 1D to 3D
“Nanocarbon Interconnects: from 1D to 3D” by Professor Cary Y. Yang, Professor of Electrical Engineering and Director of TENT Laboratory, Santa Clara University, USA. IEEE Fellow. Date: December 9, 2020… Read more
IEEE Technical Talk – Process Integration and Reliability for Copper Interconnects in Low-k Dielectrics
“Process Integration and Reliability for Copper Interconnects in Low-k Dielectrics” by Jeffrey Gambino, PhD, IBM Microelectronics, Essex Junction, Vermont, USA. Date: August 25, 2011 (Thursday) Time: 7:00 pm – 9:00… Read more