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IEEE Technical Talk – Process Integration and Reliability for Copper Interconnects in Low-k Dielectrics

Posted on August 15, 2011 by IEEE Penang

“Process Integration and Reliability for Copper Interconnects in Low-k Dielectrics” by Jeffrey Gambino, PhD, IBM Microelectronics, Essex Junction, Vermont, USA. Date:  August 25, 2011 (Thursday) Time:  7:00 pm – 9:00… Read more →

Tagged copper, dielectrics, integration, interconnects, low-k, process, reliability

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