Keynote presentations will be held on Tuesday, June 26

Keynote #1
Alan Mantooth, University of Arkansas

Emerging Trends in Wide Bandgap Power Electronics

Economy and performance are benefits that come with high power density power electronics, just as in the case of VLSI electronics. High density power electronics require the heterogeneous integration of disparate technologies including power semiconductor devices, driver, protection and control circuitry, passives and voltage isolation techniques into single modules. One of the keys to advancing power electronic integration has been the commercial reality of wide bandgap power semiconductor devices made from silicon carbide and gallium nitride. The ability to design and manufacture wide bandgap integrated circuits as drivers, controllers, and protection circuitry allows them to be packaged in close proximity to the power device die to minimize parasitics that would adversely impact system performance. These impacts include excessive ringing, noise generation, power loss, and, potentially, self-destruction. This talk will describe emerging trends in silicon carbide analog and mixed-signal IC design for power electronic applications. Advanced 3D packaging techniques driven by multi-objective optimization techniques will also be described.

H. Alan Mantooth is a Distinguished Professor of Electrical Engineering at the University of Arkansas and holder of the 21st Century Research Leadership Chair. Dr. Mantooth has 20 years of academic experience in addition to 8 years in industry. He has served in several leadership positions in both industry and academe, and currently serves as Executive Director for the NSF Research Center on GRid-connected Advanced Power Electronic Systems (GRAPES), the DoE Cybersecurity Center on Secure, Evolvable Energy Delivery Systems (SEEDS), and as Deputy Director for the NSF Engineering Research Center for Power Optimization of Electro-Thermal Systems (POETS). Since its inception in 2005 he has served as the Executive Director of the National Center for Reliable Electric Power Transportation (NCREPT) and overseen its research and building program, which includes a 6 MVA/15 kV test facility. Dr. Mantooth has published over 300 refereed articles and three books on modeling, design automation, power and analog circuit design and electronic packaging. He is an IEEE Fellow, has served on the IEEE PELS Advisory Committee since 2004 and was elected PELS President for 2017 and 2018.