co-sponsor with SSC

First Talk:

Speaker: Dr. Cyrus Bamji, Microsoft Corp.

A 512×424 CMOS 3D Time-of-Flight Image Sensor with Multi-Frequency Photo-Demodulation up to 130MHz and 2GS/s ADC

Paper and presentation available here. (IEEExplore Subscription required)

Abstract

In this talk, the pixel and signal path of a 512×424-pixel ToF image sensor is presented. Consecutive frames with different modulation frequencies are combined, which enables a range error of less than 1% over ranges from 0.8 to 4.2m. Modulation frequencies up to 130MHz are supported, and the modulation contrast at 50MHz is 67%.

Bio

Cyrus Bamji received his SB, SM and PhD (1989) in EECS from MIT.  His early works were in the area of CAD where he won several best paper awards and wrote a book on hierarchical compaction techniques.  He is the inventor of over 40 patents most in the field of TOF.  He was the CTO and a co-founder of Canesta a TOF company acquired in 2010 by Microsoft.  He now develops next generation TOF technologies at Microsoft.

Second talk:

Speaker: Dr. Richard J. Pzybyla, Chirp Microsystems

Ultrasonic 3D Rangefinder on a Chip

Paper and presentation available here. (IEEExplore subscription required)

Abstract

An ultrasonic 3D rangefinder system uses an array of AlN MEMS transducers and custom readout electronics to localize targets over a +/-45 degree field of view up to 1m away. The 0.18μm CMOS readout ASIC comprises 10 independent channels with separate high voltage transmitters, readout amplifiers, and ADCs. Power dissipation is 400μW at 30fps, and scales to 10μW/ch at 10fps.

Bio

Richard J. Przybyla received the B.S. degree in electrical engineering from Oregon State University in 2008. Last year, he received his Ph.D. in electrical engineering from Professor Bernhard Boser’s group at University of California, Berkeley. He is a co-founder of Chirp Microsystems, which is commercializing low-power ultrasonic sensor systems. Dr. Przybyla is interested in circuits and systems which interface to the physical world.