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Date: June 15th, 2023
“Hybrid Bonding: Greater Functionality, Higher Performance and Smaller Size”



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“Hybrid Bonding: Greater Functionality, Higher Performance and Smaller Size”

Date: June 15th, 2023

Speaker: Dr. Guilian Gao

June 15 @ 12pm

Event Organized By: IEEE Santa Clara Valley Electronics Packaging Society

Co-Sponsored By: IEEE Santa Clara Valley Circuits and Systems Society

Location: SEMI World Hdqtrs, 673 South Milpitas Boulevard, Milpitas, CA 95035 United States,(and via WebEx)

Check-in: on-site at 11:30 AM (sandwiches and drinks); Presentation at 12:00 noon (PDT)

Pre-register Here (Required): Link

Abstract: Massive demands are being placed on computing due to skyrocketing increases in data consumption. Penetration of AI and ML into more and more fields requires real-time fast processing at the edge as well as fast data transfer to datacenters for analysis. 5G and 6G technologies demand ever increasing frequency for wireless communications. Autonomous driving and other harsh environments demand high reliability. The semiconductor industry needs to continuously deliver better performance from a smaller footprint with higher frequency response, higher reliability, lower power consumption, and all with a lower barrier for entry than advances at the transistor level. How are these rigorous market demands influencing innovations in chip manufacturing and advanced interconnect such as hybrid bonding? This presentation will give a brief introduction of the hybrid bonding technology, how it enables disaggregation and heterogeneous integration and helps increase efficiency and performance while shrinking footprint, and how it enables high reliability.

Bio: Guilian Gao received her Ph.D. in Materials Science from the University of Cambridge, UK, her M.S. in Corrosion and Protection from University of Manchester, UK and her B.S. in Materials Science and Engineering from Beihang University, China. Dr. Gao has 34 years of experience in electronics packaging technology development, materials, processes, and reliability engineering. She is currently a Distinguished Engineer in 3D Technology at Adeia in San Jose. Prior to her current assignment, she was a Staff Engineer and Program Manager at Tessera Inc. Before joining Tessera, she was a Senior Technical Specialist at Ford Motor Co. and was awarded the Henry Ford Technology Award — the highest award for technical achievement in Ford Motor Company. Dr. Gao holds 70 US patents and has more than 40 publications.

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