SkyWater Technology Foundry produces first wafers in a drive to match performance of cutting-edge silicon chips
Here’s something you don’t see very often at government-sponsored technology meetings—spontaneous applause. It happened at DARPA’s Electronics Resurgence Initiative Summit this week when MIT assistant professor Max Shulaker held up a silicon wafer that is the first step in proving DARPA’s plan to turn a trailing edge foundry into something that can produce chips that can compete—even in a limited sense—with the world’s leading edge foundries.
“This wafer was made just last Friday… and it’s the first monolithic 3D IC ever fabricated within a foundry,” he told the crowd of several hundred engineers Tuesday in Detroit