With the end of Moore’s Law as an economic driver at 28nm, and publication of the final edition of the ITRS in July 2016, we find packaging is now on the center stage of semiconductor innovation — but what roadmap do we follow? This presentation will discuss prior roadmaps and how the packaging industry is responding with a product-based integrated solution roadmap. The presenter will discuss the goals of Heterogeneous Integration for High Performance Computing Applications and the packaging solutions this will drive.

Speaker(s): Ivor,

Location:
Bldg: SEMI International Headquarters
673 S Milpitas Blvd
Milpitas, California
95935