Summary: Heterogeneous Integration will be the key technology direction going forward, for device and subsystem integration. It is the “low hanging fruit” for initiating a new era of technological and scientific advances to continue and complement the progression of Moore’s Law scaling into the distant future. Presentations from HIR Technical Working Group chairs.  

Location:
Bldg: SEMI International Headquarters
673 S Milpitas Blvd
Milpitas, California
95035