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Recording and Slides of High-Density 3D Power Packaging with Heterogeneous Passive-Active Integration

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Topic: IEEE Miami Section Invited Webinar on High-Density 3D Power Packaging with Heterogeneous Passive-Active Integration by Dr. Raj
Date: Mar 30, 2021 12:53 PM Eastern Time (US and Canada)
Link to Recording:
https://fiu.zoom.us/rec/share/wN53Q3QSCloJjuM_mAC2QXrFJAGRZulHeCmtMiGcW7-6f4C4_624eQKQ3lKg9fcm.6mKdcy3A-l9oADkZ

PDF Slides:
http://site.ieee.org/miami/files/2021/04/Raj-Heterogeneous-Integration-IEEE-Miami-Seminar-Cond.pdf

Link to details of meeting:
https://site.ieee.org/miami/?p=2241

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