MEMBERSHIP
Chair: Dr. Kevin Xiaoxiong Gu (Email: xgu@ieee.org)
Dr. Kevin Gu currently serves as Chair of “Microwave and Millimeter-wave Packaging, Interconnect and Integration” technical committee (TC16) at IEEE Microwave Theory and Technology Society (MTT-S), and “RF and THz Technologies” technical committee at IEEE Electronics Packaging Society (EP-S), respectively. He was a Research Staff Member at IBM T. J. Watson Research Center from 2007 to 2021, and the Director of RF System Integration at Metawave Corporation from 2021 to 2023. He is the founder of an early-stage startup Astrabeam working on sub-THz sensor components and systems. Dr. Gu has authored and coauthored over 100 peer-reviewed publications, 3 book chapters and holds 9 issued patents. He is a recipient of numerous paper and career awards including an Exceptional Technical Achievement Award from IEEE EP-S in 2022.
Co-Chair: Prof. Pulugurtha Markondeya Raj
Dr. M. Raj Pulugurtha’s (P. M. Raj) expertise is in the packaging of electronic and bioelectronic systems, power-supply and wireless component integration in flex and rigid packages, and biocompatible and hermetic packaging with high-density feedthroughs. He is an is an Associate Professor at Florida International University. He co-led several technical thrusts in electronic packaging, working with the whole electronic ecosystem, which includes semiconductor, packaging, material, tool, and end-user companies. He is widely recognized for his contributions in electronic hardware integration and technology roadmapping, components for bioelectronic, power and RF modules, and also for promoting the role of nanomaterials and nanostructures for electronics packaging applications, as evident through his several industry partnerships, invited presentations, publications and awards.
Current TC members are from IEEE ECTC ED&A (electrical design & analysis) subcommittee. Our TC annual meeting is jointly held with ED&A subcommittee meeting at ECTC. We cordially welcome non-ED&A members to join the TC. Please contact the TC chair regarding new TC member application if there is any interest.
Amit P. Agrawal (AMD)
Charles Nan-Cheng Chen (WinWay Technology Co.)
Chuei-Tang Wang (TSMC)
Craig Gaw (NXP Semiconductor)
Eric Beyne (IMEC)
Hideki Sasaki (Rapidus Corp.)
Ivan Ndip (Fraunhofer IZM/ Brandenburg University of Technology)
Jaemin Shin (Qualcomm)
Kemal Aygun (Intel)
Kevin Xiaoxiong Gu (Astrabeam)
Lianjun Liu (NXP Semiconductor)
Li-Cheng Shen (USI)
Maciej Wojnowski (Infineon)
Manos M. Tentzeris (Georgia Tech)
Prem Chahal (Michigan State University)
Raj P. Markondeya (Florida International University)
Rajen Murugan (Texas Instruments)
Rockwell Hsu (Cisco)
Wendem Beyene (Meta)
Yong-Kyu Yoon (University of Florida)
Zhaoqing Chen (IBM)
Sungwook Moon (Samsung)
Srikrishna Sitaraman (Marvell)
Xiao Sun (IMEC)
TC communication and website maintenance:
Sajith Rathnayaka (Florida International University)