IEEE Transactions on Nanotechnology
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The IEEE Transactions on Nanotechnology (TNANO) publishes novel and important results in engineering at the nanoscale.  


 

Special Section on International Electron Devices and Material Symposium

The IEEE Transactions on Nanotechnology (TNANO) seeks original manuscripts for a Special Section following the 2019 edition of the International Electron Devices and Material Symposium (IEDMS 2019).

Nanotechnology in semiconductor electronic devices and materials motivates numerous innovative applications across multiple diverse scientific and industrial sectors. Researchers, Scientists, Engineers, and Practitioner throughout the world are contributing their latest research findings, ideas, developments, and applications in the areas of nanotechnology including electron devices and materials.

To make research presented at the INTERNATIONAL ELECTRON DEVICES & MATERIALS SYMPOSIUM (IEDMS 2019) widely available in expanded form and in a single venue, IEEE Transactions on Nanotechnology (TNANO) is extending a Call For Papers for a Special Issue reflecting the scope of the conference.

Submitted manuscripts will undergo a full peer review process. Submissions are welcome, and all interested IEDMS 2019 participants are encouraged to submit. Authors who are attendees are requested to significantly expand the previous conference version to contain substantial new technical material, as per TNANO and IEEE restrictions on duplicated publications and the competitive acceptance process.

Manuscripts for the TNANO Special Issue/Section must be submitted on-line using the IEEE TNANO manuscript template and “Information for Authors”, via IEEE Manuscript Central https://mc.manuscriptcentral.com/tnano. On submission to TNANO, authors should select the “Special Issue” manuscript type instead of “Regular Paper.”

Submissions that reflect the Conference Scope and current state of the field are welcome in areas including but not limited to:

  • Nanotechnology in Compound Semiconductor Materials and Devices
    Material growth, high-speed devices, lasers, light-emitting diodes, photodetectors and organic electronics, power devices, associated characterization, modeling, simulation and reliability

  • Nanomanufacturing and Nanofabrication in Novel Materials, Large-Area Electronics, and Related Applications
    Material preparation, thin-film transistors, 2D semiconductor devices, thermoelectric devices, associated characterization, modeling, simulation and reliability

  • Nanoelectronics in Si-Based Processing, Devices and Integration
    Novel processes and devices (Si, SiGe, Ge), low power ICs, high-voltage devices, optoelectronic ICs, memories, 3D ICs and integration, associated characterization, modeling, simulation and reliability

  • Nano Photonics and Nano Optoelectronics in Photovoltaic Materials/Devices, Novel Device Concept and Applications
    Novel nanostructures, energy-con version devices, solar cells, spintronics, MEMS, sensor materials and devices, associated characterization, modeling, simulation and reliability

Important Dates

  • Submission of papers: December 20, 2019
  • Notification of first review results: March 1, 2020
  • Submission of revised papers: May 1, 2020
  • Notification of final review results: June 1, 2020

Guest editors:
Chao-Sung Lai (Chang Gung University, Taiwan) cslai@mail.cgu.edu.tw
Chia-Ming Yang (Chang Gung University, Taiwan) cmyang@mail.cgu.edu.tw
Tzung-Fang Guo (National Cheng Kung University, Taiwan) guotf@mail.ncku.edu.tw

Contact email: iedms2019@email.ncku.edu.tw


Thematic Issue - Letters: Nanomechanics and Nanomanipulation of Low-Dimensional Nanomaterials

Call for Papers-Special Issue TNANO LETTERS

Nanomechanics and Nanomanipulation of Low-Dimensional Nanomaterials

IEEE International Conference on Nanotechnology (IEEE-NANO 2019)

With the rapid developments of low-dimensional (1D and 2D) nanomaterials in the last decades, critical issues
emerge regarding the precise manipulation and mechanical characterization of individual nanoscale building
blocks for their further electronic and functional applications. Various nanomanipulation and characterization
systems (such as AFM-atomic force microscopy, optical tweezers, magnetic field control, nanoindentation
techniques, etc) had been proposed since the 1990s. With the help of scanning and transmission electron
microscopy (SEM and TEM) as well as super-resolution optical microscopes, researchers now have the power to
manipulate and measure individual nanostructures with an intuitionistic, real-time, and in situ way, which
effectively accelerated the characterization and application of these nanomaterials in electronics, mechatronic
and biomedical fields. Despite these fascinating progresses, mechanics is the fundamental branch of natural
science, which concerned with the behavior of physical bodies when subjected to force or displacement, which
remains critical for structures at the nanoscale. Due to their nanosizes and high surface-area-to-volume ratio,
superior and unconventional mechanical properties, low-dimensional nanomaterials have significant influences
on their integration and real-device performance of the low-dimensional nanosystems.

The “Letters” Section (i.e., maximum of 4 pages of manuscript) in the IEEE Transactions on Nanotechnology
(TNANO) will devote a themed issue on “Nanomechanics and Nanomanipulation of Low-Dimensional
Nanomaterials”
to a collection of papers reflecting a more focused scope of the IEEE-NANO 2019
conference, especially highlighting research and technology development in the field of electronic and electrical
engineering, M/NEMS, micro/nanofabrication, nanomechanical sensors and actuators, micro/nanorobotics, and
1D/2D nanomaterials' mechanical behavior and deformation mechanism. We are accepting submissions only
from authors who have submitted abstracts for review to the conference, and invited speakers including Invite
Sessions, Keynote, and Plenary Speakers. Authors whose abstract has been accepted by the conference and
will submit full paper for IEEE Xplore Database inclusion MUST significantly expand and improve the previous
conference version to contain substantially new technical results for consideration of this Special Issue. (Please
refer to the information in the following website for IEEE TNANO regulations:
http://site.ieee.org/tnano/author-info/

All submitted manuscripts will undergo a full peer review process. Areas of interest include but are not limited to:

  • Mechanical design of novel nanomanipulation and nanorobotic systems
  • in situ SEM/TEM/SPM mechanical characterization of 1D (nanowire/nanotube) and 2D (graphene/MoS2 etc.)
    nanomaterials
  • Modeling and simulation of mechanical properties of low-dimensional nanomaterials, based on first principles,
    molecular dynamics, etc
  • Mechanical properties of nanoelectronics and electromechanical systems and flexible electronics
  • Electromechanical properties, fatigue properties, interfacial properties of low-dimensional nanomaterials
    and their solid/liquid interfaces

Accepted papers are published on the web in IEEE Xplore as soon as they are submitted in final form.
Web-published papers have a DOI (Digital Object Identifier), and are fully citable and downloadable.
Submissions are solicited from conference participants and other researchers in the field of original research
and perspectives and mini-reviews on emerging topics for this themed issue. Papers submitted to the “Letters”
are limited to a maximum of 4 journal pages in the two-column IEEE format, which includes figures, tables, and references.
Manuscripts will be subject to the same competitive and constructive peer-review criteria of TNANO with no article publishing charges.

Follow the guideline (http://site.ieee.org/tnano/author-info/), and submit your paper to ScholarOne
Manuscripts at http://mc.manuscriptcentral.com/tnano, indicating in the cover letter that you wish the paper
to be considered for the Special Issue “IEEE Transactions on Nanotechnology (TNANO) Special Section/Issue on the Annual IEEE International Conference on Nanotechnology (IEEE-NANO 2019)”. Note that the submitted
article cannot be a verbatim copy of a published conference article and your manuscript must contain at least 30% new results when compared with IEEE NANO 2019 conference papers.

Deadlines

  • Submission deadline: August 31, 2019
  • Notification of first review results: September 30, 2019
  • Submission of revised papers: October 31, 2019
  • Notification of final review results: November 30, 2019

Expected Date of Publication: The typical review process for TNANO is ~30 days before first decision. Once
accepted and the authors have complied with all IEEE copyright issues your paper will receive an official DOI
number and your paper will be available online on TNANO website under IEEE Xplore database. (Starting in
January 2019, IEEE TNANO will no longer have hardcopies, so as soon as your paper is accepted and approved
for final publication by the IEEE, it will be added to the transaction’s publication list, and will be SCI indexed.)
The expected publication date from your manuscript submission from receiving a DOI for your paper is ~100
days based on 2018 publication database)

Guest editors

Yang LU, Ph.D. (Leading Guest Editor for Inquiry)
Associate Professor
Department of Mechanical Engineering
City University of Hong Kong
Hong Kong SAR, China
Email: yanglu@cityu.edu.hk

Weidong WANG, Ph.D.
Professor
School of Mechano-Electronic Engineering
Research Center of Micro/Nano Systems
Xidian University
Xi’an, Shaanxi 710071, China
Email: wangwd@mail.xidian.edu.cn

Minglin LI, Ph.D.
Associate Professor
School of Mechanical Engineering and Automation
Fuzhou University
Fuzhou, Fujian 350108, China
Email: liminglin@fzu.edu.cn

Contact person
Yang LU, Ph.D.
Associate Professor
Department of Mechanical Engineering
City University of Hong Kong
Room Y6613, Yeung Kin Man Academic Building
Phone: +852-3442-4061
Email: yanglu@cityu.edu.hk


Message from the Editor-In-Chief

Also this year as the flagship publication of the IEEE Nanotechnology Council (NTC), I am pleased to report that the IEEE Transactions on Nanotechnology (TNANO) has achieved new heights across all endeavors of operation.

2017 is the third consecutive year with record numbers in terms of number of submissions; moreover, selectivity has remained nearly constant, so confirming that TNANO has reached an excellent level of overall scholarship. In quantitative terms, Manuscript Central Scholar One reports the following very impressive statistics for the 2017 calendar year (the data for 2016 is reported between parentheses):

  • Number of regular manuscript submissions: 797 (758)
  • Number of “Letter” submissions: 124 (0)
  • Total number of submissions: 921 (758)
  • Acceptance rate: 31% (28%)
  • Rejection rate: 50% (54%)
  • Revise-and-resubmit rate: 19% (18%)


Read the rest of the editorial here.


 

Announcement: ENANO becomes “Letters” in TNANO

 
The IEEE Nanotechnology Council (NTC) is excited to announce the launch of the category “Letters” in IEEE Transactions on Nanotechnology (TNANO) by merging IEEE Nanotechnology Express (ENANO) with TNANO. Led by the newly appointed Associate Editor-in-Chief, Prof. Gwo-Bin Lee, under the leadership of the Editor-in-Chief, Prof. Fabrizio Lombardi, the “Letters” in TNANO serves as forum for rapid publication of high-quality articles – featuring the topics of great current interest in all areas of nanotechnology, including nanoscale materials, devices, systems, and applications, and their underlying science, which cover the interdisciplinary and multidisciplinary areas across engineering, material science, physics, chemistry, biology, medicine, and related disciplines.

 
The “Letters” in TNANO publishes a collection of peer-reviewed short reports of original research and perspectives and mini-reviews on emerging topics. Papers submitted to the “Letters” are limited to a maximum of 4 journal pages in the two-column IEEE format, which includes figures, tables, and references. The “Letters” in TNANO maintains the same competitive and constructive peer-review criteria of TNANO with no article publishing charges.

 
TNANO is now accepting submissions for the “Letters”. The TNANO manuscript submission process is fully electronic to ensure the rapid publication of results. Manuscripts should be submitted via ScholarOne Manuscripts at . The submission to publication time is expected to be approximately six weeks. Accepted papers are published on the web in IEEE Xplore as soon as they are submitted in final form. Web-published papers have a DOI (Digital Object Identifier), and are fully citable and downloadable.

 
Submit your manuscript to the “Letters” in TNANO!


Information about TNANO

TNANO focuses on nanoscale devices, systems, materials and applications, and on their underlying science. It is an interdisciplinary journal that covers all areas of nanotechnology. The hardcopy version is published bi-monthly, but accepted papers are published on the web as soon as they are submitted in final form. TNANO is a publication of the IEEE Nanotechnology Council.

TNANO is a Hybrid Journal, which means that it allows either:

  • Traditional manuscript submission
  • Open Access (author-pays OA) manuscript submission at a discounted rate


 TNANO publishes Research Letters, Regular Papers, and Correspondence Items. Research Letters must not exceed four printed pages. They are subject to the same thorough review process as Regular Papers, but receive priority treatment. A Research Letter that is accepted without major revisions is expected to be published on the web within 4 to 6 weeks of its initial submission.


Areas covered by TNANO include, but are not limited to:

  • Nano and Molecular Electronics
  • Circuits and Architectures
  • Nanomagnetism and Spintronics
  • Nano-Optics, Nano-Optoelectronics and Nanophotonics
  • Nanorobotics and Nanoassembly
  • Nanosensors and Nanoactuators
  • Nanomechanics and Nanoelectromechanical Systems
  • Nanobiotechnology and Nanomedicine
  • Nanofabrication and Nanolithography
  • Nanometrology and Characterization
  • Computational Nanotechnology


Additional information on these is found here.