ICESS 2019: Call for Papers – submission deadline March 12, 2019


The 15th IEEE International Conference on Embedded Software and Systems

(ICESS 2019)

Las Vegas Convention Center, Nevada, United States, June 2-3, 2019

Co-located with DAC 2019 (participants can access DAC Keynotes, Exhibits and Receptions)


The advancement of embedded software and systems, such as intelligent vehicles, industrial robots, wearable devices, and Internet-of-Things, has great societal and economic impacts. It is of utmost importance to ensure the safety, efficiency, and security of their design and implementation. The IEEE International Conference on Embedded Software and Systems (ICESS) is a global forum for researchers and developers from academia, industry, and government to present and discuss emerging ideas and trends in embedded software and systems. The conference has a broad scope covering the design, implementation, optimization, and validation of embedded software and systems in various domains, with recent focus on cyber-physical systems, Internet-of-Things, embedded security, and autonomous software systems.

ICESS 2019 is the 15th IEEE International Conference on Embedded Software and Systems. The conference will be collocated with the Design Automation Conference (DAC) 2019 in Las Vegas, Nevada, USA. Participants can access DAC exhibits, keynotes, and receptions. It is the next event of a series of highly successful international conferences, held in recent years as ICESS 2017 (Sydney, Australia), ICESS 2016 (Sichuan, China), ICESS 2015 (New York, USA), ICESS 2014 (Paris, France), ICESS 2013 (Sydney, Australia), ICESS 2012 (Liverpool, UK), ICESS 2011 (Changsha, China), and ICESS 2010 (Bradford, UK).

All accepted papers are expected to be included in IEEE Xplore and indexed by EI. Selected papers, after further revisions, will be considered for publication in a special issue of the Elsevier Journal of Systems Architecture. ICESS 2019 will be sponsored by the IEEE, the IEEE Computer Society, the IEEE Technical Committee on Scalable Computing (TCSC), and the IEEE Technical Committee on Cyber-Physical Systems (TCCPS), pending approval.


Conference Scope

Topics of interest include, but are not limited to:

Systems, Models & Algorithms Track

  • Embedded System Architecture
  • Embedded Software Architectures
  • Embedded OS, Scheduling and Runtime Support
  • Embedded Storage and I/O Systems
  • Real-Time Embedded Systems
  • Distributed and Networked Embedded Systems
  • Fault Tolerant and Trusted Embedded Systems
  • Power and Thermal Aware Computing
  • Mixed-Criticality Embedded Systems
  • Heterogeneous SoC and Multicore Embedded Systems
  • Reconfigurable Embedded Computing

Design Methodology & Tools Track

  • Design Technologies of Embedded Systems
  • Formal Methods for Embedded Systems
  • Middleware for Embedded Systems
  • IDE and Software Tools
  • Hardware/Software Co-Design
  • Component-Based Embedded Software Design
  • Model-based Design for Embedded Software
  • Domain/Application-Specific Design Techniques
  • Testing Techniques for Embedded Software/Systems
  • Verification and Validation for Embedded Systems
  • Compilation and Debug Techniques and Tools
  • Performance Evaluation Techniques and Tools
  • Safety of Machine Learning for Embedded Systems

Emerging Embedded Applications and Interdisciplinary Topics Track

  • Intelligent Embedded Systems
  • Machine Learning for Embedded Applications
  • Internet-of-Things (IoT)
  • Wearable Computing
  • Smart City
  • Robotics and Control Systems
  • Wireless Sensor Networks
  • Cyber-Physical Systems (CPS)
  • Assured Autonomy for Safety-Critical CPS
  • Automotive and Avionics Systems
  • Medical Systems
  • Database & Multimedia Systems
  • Network Protocols and Security
  • Emergency and Disaster Management
  • Consumer Electronics
  • Mobile Cloud Computing
  • Industrial Practices and Case Studies


Paper Submission Guidelines

Submissions should contain significant novel ideas and technical results that have not been published or concurrently submitted to any other venue. Submitted manuscripts should be written in English conforming to the IEEE conference proceedings format (8.5” x 11” page size, two-column). All paper submissions must represent original and unpublished work. Papers must be submitted as PDF files through EasyChair website:

Papers should not be longer than 8 pages in the IEEE conference format. Some papers may be accepted after review as short papers; the camera-ready versions of such papers should normally not exceed 4 pages. Authors of accepted papers (regular-length or short papers) will have the option to pay for up to 2 extra pages at the time of registration.


Important Dates

Paper Submission: March 12, 2019, 11:59 p.m. Anywhere on Earth

Notification: April 2, 2019

Camera-ready version: April 30, 2019

Conference: June 2-3, 2019


Organizing Committee

General Chairs:

Naijun Zhan, Chinese Academy of Sciences, China

Qi Zhu, Northwestern University, USA

Technical Program Committee Chairs:

Arvind Easwaran, Nanyang Technological University, Singapore

Sandip Ray, University of Florida, USA

Special Session Chair:

Chung-Wei Lin, National Taiwan University

Finance Chair:

Dakai Zhu, University of Texas at San Antonio, USA

Publication Chair:

Yier Jin, University of Florida, USA

Publicity Chairs:

Wanli Chang, University of York, UK

Mingsong Chen, East China Normal University, China

Shangping Ren, San Diego State University, USA

Web Chair:

Xue Bai, Chinese Academy of Sciences, China

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