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Emerging electronic materials for future smart sensors
2019-10-30 @ 10:00 - 11:00
Speaker: Assistant Professor Sten Vollebregt
TU Delft, The Netherlands
Current sensors in integrated circuits often utilize silicon as sensing material. However, for many applications this not necessarily results in the best sensor performance in terms of sensitivity, stability size, power consumption, etc. Because of this there has been a need for different sensing materials to overcome these limitations.
Emerging electronic materials, like wide bandgap semiconductors and nano-scale materials, can potentially outperform classical materials like Si or even provide functionality which cannot be obtained otherwise. Because of this, these materials hold many promises for the next generation of sensors. In this talk I will give an overview of our activities on the development of future smart sensors based on nanomaterials (specifically carbon nanotubes and graphene) and wide bandgap semiconductors (SiC).
Sten Vollebregt received his B.Sc. and M.Sc. (both cum laude) in Electrical Engineering in ‘06 and ‘09, respectively. In 2014 he obtained his Ph.D. in the Microelectronics Department of the Delft University of Technology on the low-temperature high-density growth of carbon nanotubes for application as vias in 3D monolithic integrated circuits. After obtaining his Ph.D., he held a post-doc position on the wafer-scale integration of graphene for sensing applications. During this research, he developed a novel transfer-free wafer-scale CVD graphene process.
Currently he is an assistant professor in the Laboratory of Electronic Components, Technology and Materials of the Delft University of Technology where his research focusses on the integration of emerging electronic materials into semiconductor technology. His current research interests are (carbon-based) nanomaterials, 3D monolithic integration, wide-bandgap semiconductors, and environmental sensors. He co-authored over 20 scientific articles and 4 book chapters, and has 2 patents pending.