2020 IEEE Technology Engineering Management Society International Conference
TEMSCON 2020 will bring together 200+ engineering leaders, researchers, educators, innovators, entrepreneurs, and students to gather at the conference to help advance the understanding and the state of practice related to successful technology and engineering management from around the world and focuses on the art and science of management and leadership driving innovation and change.
Date: June 6-9, 2020
Location: Embassy Suites by Hilton in Livonia, Michigan
Call for Papers: https://temscon.org/call-for-papers/
Paper Submission Due: March 31, 2020
Registration: see https://temscon.org/registration/