IEEE Schenectady Section


Archive for the ‘Student Branches’ Category

Application of Digital Twins for Future Intelligent and Sustainable Power and Energy Systems – Wednesday June 21, 2023 12-1 PM, virtual event

Wednesday, June 14th, 2023

A technical talk on hardware in the loop simulation for power systems presented by Dr. Ivan Celanovic

Vannevar Bush’s Differential Analyzer, as well as Apollo 13 mission physical twin were a few early examples of how system twins could provide transformational capability to engineers and scientist.  With advent of modern Digital Twins, which brought fidelity, flexibility, ease of use, and the ability to evolve/adapt and learn digital twins have been fueling revolution in many disciplines including power electronics and intelligent power and energy systems.  In this talk we will cover the history of power systems simulation and focus on advanced modeling and simulation of power electronics and digital power systems as they pertain to building future grid with deep penetration of renewables. We will highlight modeling and simulation of Battery Energy Storage Systems and focus on high-fidelity digital twin and hardware in the loop simulation and discuss vast opportunities that digital twin are bringing as modeling, data, and machine learning converge.

Dr. Ivan Celanovic is Co-founder and Chief Business Development Officer (CBDO) of Typhoon HIL Inc., and Principal Research Scientist at the MIT Institute for Soldier Nanotechnologies. His passion is developing, transitioning, and commercializing new and disruptive energy technologies with focus on future grid, e-Mobility, renewables, and energy storage.  He is particularly passionate about transitioning fundamental research from a lab to commercial world. Dr. Celanovic has published over 80 journal publications, 5 patents, and two book chapters. He holds an Sc.D. degree from the Massachusetts Institute of Technology (MIT), Cambridge, an M.Sc. degree from Virginia Polytechnic Institute and State University, and a Diploma Engineer degree from the University of Novi Sad, Republic of Serbia, all in electrical engineering and computer science.


Digital Twins for Future Intelligent and Sustainable Power and Energy Systems

Open Access and Interoperable Modeling and Simulation Technologies for Power – Thurs. Feb 2nd from 12-1:30 PM (Virtual)

Thursday, January 19th, 2023

IEEE PES – Schenectady Chapter is excited to host a virtual webinar on the topic of “Open Access and Interoperable Modeling and Simulation Technologies for Power Systems”. This technical presentation will also offer one (1) continuing education credits (PDH).  The PES chapter would like to invite you to participate and learn from a well known power system modeling researcher and expert.

Speaker: Prof. (Dr.) Luigi Vanfretti from RPI.

Flyer IEEE PES webinar – Dr. Luigi Vanfretti


  • $10 for IEEE Members (Includes 1 PDH credit)
  • $15 for Non-IEEE Members (Includes 1 PDH credit)
  • Free for General Admission (No PDH credit)
  • Free for Student and Graduate Student Members (No PDH credit)

(All payments must be received by February 01, 2023).

Time: Thursday, February 02, 2023 at 12 PM, EDT

Reserve your spot by clicking on the below Register Now Tab.

“The event link will be shared on 1st February, 2023”.

Modeling and simulation is essential for a myriad of power engineering functions, from planning power grid expansions, to real-time market operations. However, existing modeling and simulation technologies lack portability requiring reimplementation and creating ambiguity, while locking-in data and analysts to specific tools. The open access Modelica language offers a new paradigm, the ability to build object-oriented equation-based models, supported by multiple tools and advanced modeling constructs. This has the potential of drastically reducing modeling costs, especially those required to meet the rapid changes that power grids are undergoing to introduce more renewable energy sources.
The seminar will introduce the Modelica language and the library for power system dynamic modeling and simulation and the strategies adopted for modeling quality and to foster adoption which include: open source development, software-to-software verification using de facto industry tools, model maintenance and model transformation tools from proprietary model descriptions and data exchange standards, all enabled thanks to the Modelica language. In addition, the talk will describe some on-going research where the power of open-access standards enable us to quickly prototype solutions for evolving use-cases where modeling and simulation is needed thanks to the efforts in developing the OpenIPSL.

Date and Time

  • Date: 02 Feb 2023
  • Time: 12:00 PM to 01:30 PM
  • All times are (UTC-05:00) Eastern Time (US & Canada)
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IEEE PES virtual technical webinar on “Open Access and Interoperable Modeling and Simulation Technologies for Power Systems“.

Time: Thursday, February 02, 2023 at 12 PM, EDT

Reserve your seat by clicking on the below Register Now Tab.

“The event link will be shared on 1st February, 2023”.



  • Starts 19 January 2023 10:00 AM
  • Ends 02 February 2023 11:00 AM
  • All times are (UTC-05:00) Eastern Time (US & Canada)
  • Admission fee

George Westinghouse Jr.’s 176th Birthday Celebration! Thursday Oct. 6th @ 5 pm

Thursday, September 22nd, 2022

Join us October 6th at the corner of State and South Ferry Street, Schenectady (across from the Edison & Steinmetz statue) to see the newly installed granite pedestal (statue coming Spring 2023) and gather with community members to celebrate George’s birthday!

Speakers include Schenectady Mayor Gary McCarthy, Metroplex Development Authority Chairman Ray Gillen, and a surprise guest – could it be Westinghouse himself?

Period music will be provided by Musicians of Ma’alwyck. Refreshments will be offered. (Rain location: Wolff’s Biergarten)

When:  Thursday, October 6, 2022 at 5:00 pm

Where: Corner of State and South Ferry Street, Schenectady (Across from the Edison & Steinmetz statue)

George Westinghouse Jr’s 176th Birthday Celebration

Daily Gazette article from September 18, 2022


Electronics Packaging Symposium – Sept 7-8, 2022 – Binghamton University

Wednesday, September 7th, 2022

This year’s symposium was organized by Binghamton University, GE Research and IBM.  We are having an electronic packaging symposium at Binghamton University on September 7th, and 8th.  Detailed information is below.  

The agenda is packed and contains timely technical talks and workshops.  A  highlight of the conference will be our keynote speaker Frank Gayle, Deputy Director of the Office of Advanced Manufacturing at the National Institute of Standards and Technology, and also Deputy Director of the Advanced Manufacturing National Program Office.

The keynote will discuss the unique opportunity to bolster the U.S. integrated circuit and packaging production supply chain.  Furthermore, with $11 billion in appropriated funds for both research and development, and education and workforce development, we can prepare for long-term U.S. leadership in microelectronics.  This keynote talk will present the opportunities described in the CHIPS ACT legislation and the approach that NIST and the Department of Commerce are taking for implementation

This symposium brings together leaders in academia, industry and government to discuss electronics packaging topics of:

  • Future of Computing for HPC and AI
  • mm Wave, 5G and 6G in Packaging
  • Power Electronics
  • Thermal Challenges / Harsh Environments
  • Flexible & Additive Electronics
  • Heterogeneous Integration
  • Advance Substrates
  • Wearable and Flexible Electronics for Medical Applications

Agenda :

This year’s program includes keynotes, 8 sessions with technical presentations, a student poster session with students from local Universities, and exhibits from leading companies.

A special panel titled “Building the North American Ecosystem for Advanced Packaging: What Comes Next” will be held to discuss the state of the Electronics Industry Ecosystem with industry and government leaders.

We will be hosting an update to the Heterogeneous Integration Roadmap and discuss the challenges that we will face in the coming years in advance packaging. We aim to share quality, up-to-date information through different lenses on trending electronics packaging topics, and provide opportunities to network, share one’s expertise, learn, and build partnerships.

General conference Information including speaker info and exhibitor opportunities:

Information on Travel and hotels may be found here:

We hope that you will join us in September.

Date and Time

  • Start time: 07 Sep 2022 08:00 AM
  • End time: 09 Sep 2022 05:00 PM
  • All times are (UTC-05:00) Eastern Time (US & Canada)
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  • Binghamton University State University of New York
  • 85 Murray Hill Road
  • Vestal , New York
  • United States 13850
  • Building: Center of Excellence
  • Room Number: Symposium Hall
  • Click here for Map




Development and Integration Strategies for Non-volatile Resistive Memory in the Context of Neuromorphic Computing – Thursday June 23, 2022 12-1 PM

Wednesday, June 22nd, 2022

Presented by Dr. Nate Cady of SUNY Polytechnic Institute

Neuromorphic and AI computing hardware is trending away from traditional von Neumann computational architectures. This transition is opening the door to a wide range of novel devices and integration solutions. Over the past 10 years, my research group has focused on fabrication and integration strategies for CMOS-compatible, non-volatile, memory devices (aka: memristors). These memristive devices have the potential to act as neuronal synapses in neural networks, but can also function as tunable elements in array-based accelerators. Introducing unique materials and novel memristive devices into the traditional CMOS fabrication process presents many challenges, from both the process integration and packaging standpoint. In this presentation I will discuss integration strategies that we have used to develop novel hardware solutions and translation of laboratory-scale demonstrations towards integration on 300mm wafer platforms utilizing the Albany Nanotech 300mm foundry.

Date and Time

  • Date: 23 Jun 2022
  • Time: 12:00 PM to 01:00 PM
  • All times are (UTC-05:00) Eastern Time (US & Canada)
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  • This event has virtual attendance info. Please visit the event page to attend virtually.
  • South Auditorium
  • Albany, New York
  • United States
  • Building: CNSE



  • Starts 03 June 2022 12:30 PM
  • Ends 23 June 2022 12:30 PM
  • All times are (UTC-05:00) Eastern Time (US & Canada)
  • No Admission Charge


Westinghouse Statue Project Committee Schenectady, New York

Wednesday, May 11th, 2022

5 years ago, citizens erected two life size statues of Thomas Edison and Charles Steinmetz along Erie Boulevard, Schenectady.  This was done so that our citizens would never forget the great heritage that we have here since the early days of creating and harnessing electricity.  But the story has not been finished. 


To better tell the story we are now erecting a larger-than-life-sized statue of local citizen, inventor, entrepreneur and philanthropist, George Westinghouse, Jr.  We have raised most of the money necessary to sculpt, cast, erect, light, landscape and tell the story of George Jr.


Be a part of this rewarding project, help remember those who have made this world better place and beautify Schenectady. Click Westinghouse Statue Project for more details.

Celebration of Dr. Manoj R. Shah – National Academy of Engineering inductee: May 25, 2022 12-1:30 (Revised date)

Thursday, April 28th, 2022

Come join us on May 25th, 2022 from 12-1:30 at the Niskayuna Reformed Church to celebrate Dr. Manoj Shah who was recently elected into the National Academy of Engineering for contributions to design, analysis, and electric machine performance enhancements.

Election to the National Academy of Engineering is among the highest professional distinctions accorded to an engineer. Academy membership honors those who have made outstanding contributions to “engineering research, practice, or education, including, where appropriate, significant contributions to the engineering literature” and to “the pioneering of new and developing fields of technology, making major advancements in traditional fields of engineering, or developing/implementing innovative approaches to engineering education.”  Election of new NAE members is the culmination of a yearlong process. The ballot is set in December and the final vote for membership occurs during January.

Individuals in the newly elected class will be formally inducted during the NAE’s annual meeting on Oct. 2, 2022. A list of the new members and international members follows, with their primary affiliations at the time of election and a brief statement of their principal engineering accomplishments can be found on the NAE website. NAE Website – National Academy of Engineering Elects 111 Members and 22 International Members


Date and Time

  • Date: 25 May 2022
  • Time: 12:00 PM to 01:30 PM
  • All times are America/New_York
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Niskayuna Reformed Church

  • 3041 Troy Schenectady Rd.
  • Niskayuna, New York
  • United States 12309



  • Starts 03 May 2022
  • Ends 25 May 2022
  • All times are America/New_York
  • No Admission Charge

Machine Learning Techniques for Network Analysis – Virtual Friday April 29, 2022 6-7 PM

Thursday, April 28th, 2022

Dr. Lateef will provide a high-level overview of the various Machine Learning Techniques and their application to large data networks analysis. He will cover the current start of the art techniques and the challenges and shortcomings. A few techniques will then be presented to address these challenges and demonstrate their application in network analysis.

IEEE Computer Lecture April 29 2022 Dr. Irfan

Date and Time

  • Date: 29 Apr 2022
  • Time: 06:00 PM to 07:00 PM
  • All times are US/Eastern
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  • This event has virtual attendance info. Please visit the event page to attend virtually.



  • Starts 20 April 2022 02:21 PM
  • Ends 29 April 2022 07:00 PM
  • All times are US/Eastern
  • No Admission Charge

Speaker: Dr. Irfan Lateef

Dr. Irfan Lateef is currently the chair of IEEE NJ Coast Section and working as a Principal Solution Architect at NEC, where he supports the global 5G business development activities, End-to-End solution engineering, partnership and alliances and sales engineering.

He has over 25 years of experience in the Telecom industry in wireline and wireless technologies including, evolving compute/network virtualization (SDN/NFV) and wireless (4G,5G) technologies directing multi-sized global teams to build new products and complex solutions for driving new revenues. Leverages trusted relationships with senior executives for driving pre-sales, solution architecture, and business development activities.

Most recently, he has been focusing on 5G Open RAN, massive MIMO, and Machine Learning technologies deployments in global Tier1 operators. He is a global technology leader who leverages technical strategy, innovative thinking, and business experience to create and sell transformative solutions in the telecom industry.

Before NEC, Irfan has worked in AT&T, Verizon, Juniper, Lucent Bell Labs, and several other startups and Tier1 telecom equipment vendors.

He has a Ph.D. in Computer Engineering and a Master’s in Telecommunications, and his topics of interest include Machine Learning, Artificial Intelligence, Eigendecomposition, Signal processing, Anomaly Detection, and RAN Cross-Layer Optimization.




Tailoring insulation surface charge behaviors: From hazards to functionality – Thursday, Nov 18, 2021

Wednesday, November 10th, 2021

A Schenectady Section DEIS technical talk presented by Dr. Chuanyang Li

Date: 18 Nov 2021
Time: 12:00 PM to 01:00 PM Eastern US
Location: Virtual (Zoom) Meeting:
Event Registration:

Charge accumulation on the insulation surface distorts the local electric field, triggers partial discharge and flashover, which poses potential threats to the insulation system of the high voltage apparatus. It is an urgent and important requirement to tailor surface charge behaviors of dielectrics for modern electrical and electronic devices.
In this report, we introduce two approaches for tailoring the surface charge behaviors, which are achieved by converting the hazard surface charges into functional charges by means of material modification. To be more specific, a novel surface charge adaptively controlling spacer used in DC GIL is developed, and a surface partial discharge mitigation method is put forward.

We do hope that the two surface charge tailoring approaches mentioned in this report may shed some light on the novel insulation design of DC electric power equipment, DC generators, power electronic devices, printed circuit board (PCB) layout, and various integrated electrostatic sensors and actuators.

Tailoring Insulation Surface Charge Behaviors from Hazards to Functionality.pdf

Albany Nanotechnology Symposium: Materials and processing innovation for future AI applications Nov 12-13, 2019

Monday, October 21st, 2019

2019 Symposium: Materials and Processing Innovation for Future AI Applications


Tuesday, Nov 12th – Wednesday, Nov 13th, 2019

Nanofab South Auditorium

SUNY Polytechnic Institute
257 Fuller Road
Albany, NY 12203


The conference will feature oral presentations and posters by authors from federal and private research institutions, industry, and academia. IEEE ANS provides a forum for creating and promoting cross-functional and interdisciplinary research. This year’s topic focuses on emerging research and insight into the development of artificial intelligence.
The 2-day program will consist of:
  • Keynote Speech by Kaushik Roy (Purdue University)
  • Plenary Talk by Lisa Amini (IBM)
  • Invited talks from experts in AI research: Geoffrey Burr (IBM), Chris Carothers (RPI), Michael Lercel (ASML)
  • Contributed oral presentations
  • “Building Trust in AI” invited talks and panel discussion by Michael Hind (IBM), Abby Everett Jaques (Stanford), Geoffrey Burr (IBM) and Selmer Bringsjord (RPI)
  • Lithography tutorial session by Luciana Meli (IBM), Richard Farrell (TEL), Charlie Liu (IBM) and Robert Brainard (CNSE)
  • Poster session

Awards for Best Poster and Best Oral Presentation will be recognized at the end of the conference.

Registration for this event is free, but please pre-register at the link at the bottom of the page! There will be limited same-day registration.



Note: Open the above link in a separate tab to log into EasyChair. Open the link again to be directed to the correct registration page.


For questions, please email our conference committee at