- This event has passed.
IEEE AP-S Distinguished Lecturer – Prof. Zhang Yue Ping
November 22, 2018 @ 11:00 AM - 12:30 PM
:: Millimeter-Wave In-Package Antennas ::
by Prof. Zhang Yue Ping, Nanyang Technological University, Singapore
Instituto Superior Técnico, Avenida Rovisco Pais, Torre Norte, Meeting Room – tbc
Antenna-in-package (AiP) technology, in which there is an antenna (or antennas) with a transceiver die (or dies) in a standard surface-mounted device, represents an important antenna technology achievement in recent years. AiP technology has been widely adopted by chip makers for 60-GHz radios and gesture radars. It has also found applications in 77-GHz automotive radars, 94-GHz phased arrays, 122-GHz imaging sensors, and 300-GHz wireless links. It is believed that AiP technology will also provide elegant antenna solutions to fifth generation and beyond operating in the lower millimeter-wave (mm-wave) bands. Thus, one can conclude that AiP technology has emerged as the mainstream antenna technology for various mm-wave applications. This lecture will start with a review of basic packaging ideas for AiP technology. Then it will focus on the co-design of antennas and packages. It will show that the antenna choice is usually based on those popular antennas that can be easily designed for the application; that the package choice is governed by the Joint Electron Device Engineering Council (JEDEC) for automatic assembly; and that the materials and processes choices involve trade-offs among constraints such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The talk also shows a probe-based setup to measure impedance and radiation of mm-wave in-package antennas. It goes on to give three AiP examples implemented, respectively, in a low-temperature co-fired ceramic process, an embedded wafer level ball grid array process, and a high-density interconnect process for 60-GHz applications. Finally, the lecture will present some recommendations on research topics to further the state of the art of AiP technology.
Zhang Yue Ping is a full Professor of Electronic Engineering with the School of Electrical and Electronic Engineering at Nanyang Technological University, Singapore, a Distinguished Lecturer of the IEEE Antennas and Propagation Society (IEEE AP-S), and a Fellow of IEEE.
Prof. Zhang was a Member of the Field Award Committee of the IEEE AP-S (2015-2017), an Associate Editor of the IEEE Transactions on Antennas and Propagation (2010-2016), and the Chair of the IEEE Singapore MTT/AP joint Chapter (2012). Prof. Zhang was selected by the Recruitment Program of Global Experts of China as a Qianren Scholar at Shanghai Jiao Tong University (2012). He was awarded a William Mong Visiting Fellowship (2005) and appointed as a Visiting Professor (2014) by the University of Hong Kong.
Prof. Zhang has published numerous papers, including two invited papers in the Proceedings of the IEEE and one invited paper in the IEEE Transactions on Antennas and Propagation. He holds 7 US patents. He received the Best Paper Award from the 2nd IEEE/IET International Symposium on Communication Systems, Networks and Digital Signal Processing, July 18–20, 2000, Bournemouth, U.K., the Best Paper Prize from the 3rd IEEE International Workshop on Antenna Technology, March 21–23, 2007, Cambridge, U.K., and the Best Paper Award from the 10th IEEE Global Symposium on Millimeter-Waves, May 24–26, 2017, Hong Kong, China. He received the prestigious IEEE AP-S Sergei A. Schelkunoff Prize Paper Award in 2012.
Prof. Zhang has made pioneering and significant contributions to the development of the antenna-in-package (AiP) technology that has been widely adopted by chip makers for millimeter-wave applications. His current research interests include the development of antenna-on-chip (AoC) technology and characterization of chip-scale propagation channels at terahertz for wireless chip area network (WCAN).