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IEEE CPMT OC Chapter – Member Resources (2015)
Technical Meeting #1:
Copper Pillar VS. Solder Bump: Which is More Reliable?: Craig Hillman – Mar. 03, 2015
Information Flier: IEEE_CPMT_OC_Chapter_03032015_craighillman
Speaker Presentation: Solder Bump vs. Copper Pillar_ver3
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IEEE CPMT OC Chapter – Member Resources (2014)
Technical Meeting #1:
Micro-Transfer-Printing of Microscale Semiconductor Devices: Chris Bower – Feb. 11, 2014
Information Flier: IEEE_CPMT_OC_Chapter_01242013_02112014ChrisBower
Speaker Presentation: CPMT_2014.02.11_V1_uTP
Technical Meeting #2:
Latest Technologies for high value Capacitors and Inductors integrated with Silicon Interposers: Franck Murray – Jun. 10, 2014
Information Flier: IEEE_CPMT_OC_Chapter_06102014FranckMurray
Speaker Presentation: 10062014_IEEE_IPDIA_LETI_OC
Technical Meeting #3:
The Development of Advanced Leadframes: Emerson Erazo – July. 17, 2014
Information Flier: IEEE_CPMT_OC_Chapter_07172014
Technical Meeting #4:
Advance Package Failure Analysis Methods: Winfield Scott – Aug. 19, 2014
Information Flier: IEEE_CPMT_OC_Chapter_Aug_19_2014_Winfield_Scott
Technical Meeting #5:
Glass as a Core Packaging Platform for Next Generation Electronic Devices: Tim Mobley – Oct. 07, 2014
Information Flier: IEEE_CPMT_OC_Chapter_10072014_Tim_Mobley
Technical Meeting #6:
The Origins of Silicon Valley: Why and How It Happened: Paul Wesling – Nov. 18, 2014
Information Flier: IEEE_CPMT_OC_Chapter_11182014_Paul_Wesling
Technical Meeting #7:
Internet of Things: Technologies Enabling The Revolution – Dec. 5, 2014
Information Flier: IEEE_Calit2_Dec_05_IoT_10_30_14
Speaker Presentation: BBottoms_Packaging Challenges UC Irvine 12-5-2014 Distribution copy DPatel_IEEE_CPMT-5Dec14-FINAL GPLi_iot uci 12052014 JDews_IOT Conference Slides – Distribution Version 12.12.14 – Final JLim_High_Speed_Serial_Link_12_5_2014 LWilliams_IoT_ Workshop_Simulation Advances for IoT Devices MAhmad_December IoE Presentation Cisco MBachmanM_IEEE_SensorsIoT MCheng – m2m landscape 2014-12-05 TLenihan_Wearables
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IEEE CPMT OC Chapter – Member Resources (2013)
Technical Meeting #1:
DRAM Market Forces of Fragmentation & Consolidation: Bill Gervasi – April 30, 2013
Information Flier: IEEE_CPMT_OC_Chapter_Apr_2013_Bill Gervasi
Speaker Presentation: IEEE CPMT OC Chapter_Speaker Presentation_Discobolus Designs
Technical Meeting #2:
Recent Advances in Anisotropic Conductive Films (ACFs) Technology: Kyung W. Paik – June 4, 2013
Information Flier: IEEE_CPMT_OC_Chapter_04_June_2013_Professor Paik
Speaker Presentation: 2013 IEEE CPMT Orange Chapter
Technical Meeting #3:
The Latest Technology Trend of Packaging Materials for Power Devices: Ken Uchida – June 25, 2013
Information Flier: IEEE_CPMT_OC_Chapter_25_June_2013_Ken Uchida
Speaker Presentation: 130623_IEEE_kyocera_chemical
Workshop #1:
SIGNAL INTEGRITY FUNDAMENTALS ONE DAY SHORT COURSE: Stephen Hall & Howard Heck – July 19, 2013
Information Flier: IEEE_CPMT_OC_Chapter_July_19_2013_SI_Fundamentals_v1.7
Speaker Presenations:
(1) differential – 2013-07-15_secure
(2) Equalization – 2013-07-15_secure
(4) transmssion line fundamentals-07172013_secure
Technical Meeting #4:
Wafer Bonding Enables New Technologies and Applications for 3D-IC: Mark Franklin – August 29, 2013
Information Flier: IEEE_CPMT_OC_Chapter_29_August_2013_Mark Franklin
Speaker Presentation: Wafer Bonding Enables New Technologies and Applications
Technical Meeting #5:
Integrated Circuit ESD/Latch-up Mechanisms and Testing: Barry Fernellius – September 12, 2013
Information Flier: IEEE_CPMT_OC_Chapter_12_September_2013_Barry Fernelius
Speaker Presentation: Latch-up_at_EAG_IEEE_September_2013
Tutorial #1:
Polymers in Electronic Packaging Afternoon Tutorial: Jeff Gotro – October 17, 2013
Information Flier: IEEE_CPMT_OC_Chapter_October_17_2013_Polymers_Tutorial
Speaker Presentation: Coming Soon!