IEEE

May 21, 2015 Technical Meeting: Recent Advances in Anisotropic Conductive Films (ACFs) Technology for Wearable Electronics

IEEE Components, Packaging and Manufacturing Technology Society – OC Chapter

Thursday, May 21, 2015 Technical Meeting

Recent Advances in Anisotropic Conductive Films (ACFs) Technology for Wearable Electronics

Kyung W.Paik

Department of Materials Science and Engineering

Nano-Packaging & Interconnect Laboratory

Korea Advanced Institute of Science and Technology(KAIST)

kwpaik@kaist.ac.kr

 

Abstract

Due to the increasing demand for higher performance, greater flexibility, smaller size, and lighter weight in mobile electronic products, there have been growing needs of wearable electronic products in near future. Wearable watches, glasses, wrist bands, shoes, and clothes have been recently introduced in the market. To realize wearable electronic products, there should be four core electronic hardware technologies – (1) flexible semiconductor, (2)flexible display, (3)flexible battery and (4)flexible packaging & interconnection technologies. In the flexible semiconductor devices, ICs are thinned down to several hundred nanometer thickness, and then transferred to a polymer film. However, much more development is still needed for the real applications of flexible semiconductors in the future. In contrast, flexible displays are already available by introducing OLED (organic LED) realized on polymer films. And flexible batteries are also demonstrated by several companies by adapting solid electrolytes. However, there has been little development on flexible packaging & interconnection areas. As a one of the promising flexible packaging and interconnection technologies, flexible printed circuits (FPCs) substrates and ACF materials based packaging and interconnection will provide the solution for realizing wearable electronic products. In the electronic packaging technology for wearable electronics, flexible IC packaging such as COF(Chip On Flex)/CIF(Chip In Flex) & FOF(Flex On Flex) technologies using FPCs substrates and ACFs materials become very important, because ACF interconnection provides excellent electrical flexibility compared with conventional solder- or socket-based interconnection methods which have a limitation of bending and flexing. In this presentation, it will be presented how the ACFs technology can be successfully used for the COF/CIF and FOF electronic packaging and interconnection methods for wearable electronics applications.

Biography

Kyung W. Paik received the Ph.D. degree from the Cornell University at the department of Materials Science and Engineering in 1989.After the Ph.D. degree, he worked at the General Electric Corporate Research and Development from 1989 to 1995, where he was involved with the R & D of materials and processes of GE High Density Interconnect (HDI) multichip module technology and power I/C packaging as a Senior Technical Staff.  And then, he joined the Korea Advanced Institute of Science and Technology (KAIST) as a professor at the department of Materials Science and Engineering in 1995, and served as the Dean of Student Affairs during 2008 ~ 2000 and the VP of Research during 2011 ~ 2013.  In his Nano-Packaging and Interconnect Laboratory (NPIL), he has been working in the areas of Anisotropic Conductive Adhesives(ACAs) materials and processing, 3-D TSV interconnect materials, solders, and MEMS & display packaging technologies, and has published more than 160 SCI journal papers and has more than 40 issued and pending US patents.  Dr. Paik has been members of the IEEE-CPMT, IMAPS, and SEMI.  And he also has actively involved in numerous international electronic packaging conferences such as ECTC, IMPACT, EMAP, EPTC, and so on as an organizer, technical committee, international liaison, session chairs and invited speakers.

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Date:              Thursday, May, 21, 2015

Location:       Broadcom Corporation, 5300 California Ave., Irvine, CA 92617 – Salt Creek

Check in at the Security Gate and proceed to Bldg. 2. You will be escorted into the building.

Time:              5:30-6:00pm: Social time, 6:00-7:00pm: Presentation, 7:00pm: Dinner (free for attendees!)               

RSVP:      IEEE members and non-members all are welcome. Please RSVP athttp://tinyurl.com/mpn8jfu

Please be at the Bldg. 2 entrance by 6:00 pm; no escorts after that. For questions regarding RSVP, please contact Zijie Cai (zijiecai@broadcom.com).

For more information please contact the following officers of the IEEE CPMT OC Chapter:


Wei Koh: (714) 417-9979                      Alexander Pfeiffenberger: (949) 926-3858                    Jiawei Zhang: (949) 926-3897

*To learn more about the IEEE CPMT OC Chapter, visit us at http://site.ieee.org/ocs-cpmt/ or join us on LinkedIn!*

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