IEEE

Feb. 11, 2014 Micro-Transfer-Printing of Microscale Semiconductor Devices

IEEE Components, Packaging and Manufacturing Technology Society – OC Chapter

 

Micro-Transfer-Printing of Microscale Semiconductor Devices

 

Chris Bower, Chief Technology Officer

X-Celeprint Ltd

Abstract

Micro-Transfer-Printing (μTP) is an emerging process technology where engineered elastomer print-heads coupled to precision motion controllers are used to “pick-up” arrays of microscale devices from their native growth substrates and then deterministically “transfers” them onto non-native substrates.  Devices compatible with μTP include lasers, LEDs, discrete transistors and silicon integrated circuits.

The first portion of the talk will focus on the science and technology of μTP.  This will include strategies for making “printable” devices and a description of the physical mechanisms utilized during μTP. The second segment of the talk will focus on applications of μTP, including silicon photonics and heterogeneous integration of compound semiconductors with silicon.  

 Biography

Chris has over fifteen years’ experience in the fabrication and packaging of novel electronic and photonic devices, both at the nanoscale and the microscale. He received his PhD in 2000 from the University of North Carolina – Chapel Hill. From 2007 to 2013 he led the transfer-printing and wafer-level-packaging group at Semprius, Inc. He is currently the Chief Technology Officer at X-Celeprint Ltd., where he leads the effort to develop and transfer the micro-transfer-printing technology to potential end-users. His interests include three-dimensional integration of integrated circuits, heterogeneous integration of compound semiconductors onto non-native substrates and the fabrication of low-cost, large-format electronics using novel assembly methods. He is an active member of IEEE CPMT and serves on the ECTC Advanced Packaging subcommittee.

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Date:              Tuesday, February 11, 2014

 Location:       Broadcom Corporation, 5300 California Ave., Irvine, CA 92617 – Bldg. 2 Room 2-1037 Salt Creek

                        Check in at the Security Gate and proceed to Bldg. 2. You will be escorted into the building.

 Time:              5:30-6:00pm: Social time, 6:00-7:00pm: Presentation, 7:00pm: Dinner

 RSVP:              IEEE members and non-members all are welcome. Please RSVP at http://tinyurl.com/n4v4afl

Please be at the Bldg. 2 entrance by 6:00 pm; no escorts after that. For questions  please contact Zijie Cai (zijiecai@broadcom.com).

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