Philip Feng

Dr. Philip Feng

Associate Professor at Case Western Reserve University
Talk Track: Emerging Electronics and Microsystems
Talk Title: Integrating SOI Nanoelectromechanical Systems (NEMS) with CMOS for ‘More than Moore’ Applications




Philip Feng is currently an Associate Professor in Electrical Engineering & Computer Science at Case Western Reserve University. His research is mainly focused on emerging semiconductor devices and integrated microsystems. He received his Ph.D. from Caltech in 2007. His recent awards include NSF CAREER Award, 4 Best Paper Awards (with his advisees, at IEEE and American Vacuum Society conferences), the Case School of Engineering Graduate Teaching Award (2014) and the Case School of Engineering Research Award (2015). He was one of the 81 young engineers selected to participate in the National Academy of Engineering (NAE) 2013 U.S. Frontier of Engineering (USFOE) Symposium. Subsequently, he was selected to receive the NAE Grainger Foundation Frontiers of Engineering (FOE) Award in 2014. A Senior Member of IEEE, he has served on the Technical Program Committees (TPC) and as Track/Session Chairs for IEEE IEDM, IEEE MEMS, Transducers, IEEE IFCS, IEEE SENSORS, IEEE NANO, etc.


Nanoscience today enables exciting emergence of low-dimensional nanostructures and advanced electronic materials with previously inaccessible properties. Meantime scaled Si CMOS and VLSI have been a hallmark and most powerful nanotechnology in real-world applications. At the frontier, emerging nanoelectromechanical systems (NEMS) offer a spectrum of new functionalities in the ‘More Than Moore’ paradigm. Accompanying the nanoscale Si CMOS, ultrathin SOI technology has also been enabling new Si NEMS and VLSI for integrated signal processing, sensing, and ultralow-power computing. This presentation will discuss recent advances and perspectives of SOI NEMS (e.g., sensors, RF resonant-channel transistors, and oscillators) and their integration with SOI nanoelectronics.