Speaker:
DR. RAJEN MURUGAN

Distinguished Member of Technical Staff

Texas Instruments

When: 12:00 pm, November 23, 2021

Place: EC Conference Room, Florida International University (FIU), EC Campus, 10555 W Flagler St Miami, Florida 33174.

This presentation provides a broad review of complex IC package/system co-design modeling challenges and opportunities. First, a study of the fundamental governing equations that capture the multi-physical interactions is presented. Next, the discussion focuses on modeling challenges to achieve desired performance while keeping costs down. Finally, IC package design examples ranging from high-performance mmWave AoP (antenna-on-package), high-power GaN power modules, to high-current automotive/industrial sensors are provided to demonstrate how modeling is employed to achieve a compromise between performance and cost.       

Link for this meeting: https://fiu.zoom.us/meeting/register/tJUkc-2sqD8jEtNXLusrbniQmHQLX8cgKIzH

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