Speaker:
Dr. Pulugurtha Markondeya Raj
Associate Professor at FIU

When: March 30, 2021 1:00 PM Eastern Time (US and Canada)

Power supply is becoming a key performance limiter in all electronic systems. This includes power conversion, regulation and noise suppression. Current approaches have many challenges including: 1) power conversion far from the load, limiting response time, 2) stages of conversion, reducing efficiency, 3) low- density inductors and capacitors and 4) large losses due to long interconnections through the board.

Advanced substrate-compatible thin film or thick film package integration processes are being developed to achieve higher power handling with thinner form-factors. The first part of the talk focuses on emerging 3D power packaging for low- to high-power applications. It will point to the common aspects and key differentiators that shift the technology focus in each case. Heterogenous package integration trends in 3D power packaging for future computing and automotive power electronic needs will be highlighted through specific examples.

Capacitors and inductors are key storage components in power conversion. Their low storage densities and efficiency along with the associated parasitics and reliability limitations have been the key bottlenecks towards advances in packaging. The second part of the talk highlights magnetic components with nanocrystalline, nanogranular and composites with 2D flake morphologies. These material and package integration advances are driving transformers with high efficiency, and high-density power inductors with current-handling and smaller footprints. By providing ultra-short interconnect lengths, these components can suppress DC power losses and high-frequency parasitics to result in higher power efficiency and power densities. Key magnetic component technologies in high power electronics will be highlighted in the final part.

Meeting will be recorded.
Link for this meeting: https://fiu.zoom.us/j/98165156669?pwd=RkRJM3dQQ0V1NGdkOXE3Z0cvcGN0dz09

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