IEEE Miami Section

March 4th, 2021

Dr. John L. Volakis
Dean of the College of Engineering and Computing at FIU

When: March 23, 2021 1:00 PM Eastern Time (US and Canada)

In recent years, a variety of flexible fabric-based electronics have been proposed. To this end, our team proposed a new class of conductive textiles that have demonstrated unique capabilities in terms of flexibility, durability and manufacturing-ease using standard automated embroidery machinery. These electronic threads (E-threads) have the capability to generate fully embroidered microwave circuitry that has the same electrical properties as traditional microwave circuits printed on PCBs. Concurrently, the developed embroidery process has been demonstrated to deliver the same accuracy as PCB technologies. Therefore, these new E-threads are providing for a path to realize full-scale wireless communication devices that are embroidered on wearable textile garments. They can therefore enable a new class of wearable devices that are not appendages, but rather fully intergraded and inconspicuously placed within clothing.

A key manufacturing feature of the proposed E-textile is their bundling process. A single thread is comprised of several 15μm thick filaments. The inner core of the filament is comprised of a 10μm polymer (Zylon or Kevlar, among others), covered by a 5μm thick metallic coating. These filaments can be bundled into 6 or more to form a single thread for weaving into the garment. As such, a ‘printing” resolution as good as 0.1 mm has been achieved. This resolution is nearly the same as that of standard Printed Circuit Boards (PCBs). Notably, by using the large surface of garments, a ten-fold increase in transmitted power of wireless signals can be achieved, enabling reliable communications at much longer distances.

Prototypes for sensors, RFIDs, antennas, WiFi boosters, and body imagers have been developed and tested for flexibility, mechanical robustness, and durability. These applications will be discussed at the meeting along with success stories for wearable wireless devices. However, several challenges remain in bringing reliable textile-based electronic devices, including wearable wideband transceivers, to the market. Among them, two challenges must be addressed: 1) reliable and repeatable interconnects, 2) chipsets that are less bulky and integrated with the textile circuitry in a reliable manner, 3) manufacturing costs. At the meeting, we will discuss these challenges and possible approaches to overcoming them.

Meeting will be recorded.
Link for this meeting:

Flyer for Event

March 4th, 2021

Dr. Pulugurtha Markondeya Raj
Associate Professor at FIU

When: March 30, 2021 1:00 PM Eastern Time (US and Canada)

Power supply is becoming a key performance limiter in all electronic systems. This includes power conversion, regulation and noise suppression. Current approaches have many challenges including: 1) power conversion far from the load, limiting response time, 2) stages of conversion, reducing efficiency, 3) low- density inductors and capacitors and 4) large losses due to long interconnections through the board.

Advanced substrate-compatible thin film or thick film package integration processes are being developed to achieve higher power handling with thinner form-factors. The first part of the talk focuses on emerging 3D power packaging for low- to high-power applications. It will point to the common aspects and key differentiators that shift the technology focus in each case. Heterogenous package integration trends in 3D power packaging for future computing and automotive power electronic needs will be highlighted through specific examples.

Capacitors and inductors are key storage components in power conversion. Their low storage densities and efficiency along with the associated parasitics and reliability limitations have been the key bottlenecks towards advances in packaging. The second part of the talk highlights magnetic components with nanocrystalline, nanogranular and composites with 2D flake morphologies. These material and package integration advances are driving transformers with high efficiency, and high-density power inductors with current-handling and smaller footprints. By providing ultra-short interconnect lengths, these components can suppress DC power losses and high-frequency parasitics to result in higher power efficiency and power densities. Key magnetic component technologies in high power electronics will be highlighted in the final part.

Meeting will be recorded.
Link for this meeting: TBA

Flyer for Event: Link

February 16th, 2021

Dr. Noah Sturcken
Chief Executive Officer / Founder

When: Feb 16, 2021 04:00 PM Eastern Time (US and Canada)

Noah is the instrumental driving force behind Ferric’s founding and integrated voltage regulator technology. Ferric is the continued work of his PhD. research project at Columbia University. He is the lead inventor and holds several patents for projects stemming from his work on integrated power conversion. He is also the lead author on five publications. Noah previously worked as a research intern for the AMD Research and Development Lab, and Analog Design team. Noah holds a PhD. in Electrical Engineering from Columbia University, in addition to a B.S. in Electrical and Computer Engineering from Cornell University.

In today’s meeting, he will give us a talk about Modern high-performance computing (HPC) processors, Integrated voltage regulators (IVRs) and a diverse set of SoC load-requirements, covering CPUs, GPUs, FPGAs, ADCs, PLLs etc.

This talk will discuss advances in IVRs addressing future HPC systems, which are increasingly adopting chip-on-wafer and wafer-on-wafer integration schemes to achieve performance and manufacturing gains.

Registration is needed.
Meeting will be recorded.
Register in advance for this meeting:

After registering, you will receive a confirmation email containing information about joining the meeting.

February 13th, 2021

REGIONAL FINALS – February 13th, 2021

Future City is a national competition in which groups of middle school students present their idea of what a city would look like 100 years from now and how that city would effectively deal with the demands of a global sustainability problem.

The project involves several components: a virtual model of the futuristic city, a physical model of a section of the city, an essay and a presentation. The students work with guidance from their teacher and an engineering mentor.

“We wanted to develop the future engineers, attract them to the field. This is what matters,” says Osama MohammedDistinguished Professor, Associate Dean for Research. Director, Energy Systems Research Laboratory  who has organized the event for the past 17 years. “This event is supporting a lot of future engineers

Link to Future City South Florida Region Site:

December 22nd, 2020

Call for Papers

Click here for the pdf

December 16th, 2020

Click here to join the webinar