Author: aaguiler
High-Density 3D Power Packaging with Heterogeneous Passive-Active Integration
Speaker:Dr. Pulugurtha Markondeya RajAssociate Professor at FIU When: March 30, 2021 1:00 PM Eastern Time (US and Canada) Power supply is becoming a key performance limiter in all electronic systems…. Read more
Recording and Slides of High-Density 3D Power Packaging with Heterogeneous Passive-Active Integration
Topic: IEEE Miami Section Invited Webinar on High-Density 3D Power Packaging with Heterogeneous Passive-Active Integration by Dr. RajDate: Mar 30, 2021 12:53 PM Eastern Time (US and Canada)Link to Recording:https://fiu.zoom.us/rec/share/wN53Q3QSCloJjuM_mAC2QXrFJAGRZulHeCmtMiGcW7-6f4C4_624eQKQ3lKg9fcm.6mKdcy3A-l9oADkZ… Read more
Conductive Textiles for Wearable Electronics
Speaker:Dr. John L. VolakisDean of the College of Engineering and Computing at FIU When: March 23, 2021 1:00 PM Eastern Time (US and Canada) In recent years, a variety of… Read more
Recording and Slides of Conductive Textiles for Wearable Electronics Presentation
Topic: IEEE Miami Section Webinar on Conductive Textiles for Wearable Electronics by John VolakisDate: Mar 23, 2021 12:51 PM Eastern Time (US and Canada)Recording Link:https://fiu.zoom.us/rec/share/oZ84z-n-jc_HT25MId1t2-CJbEcTd06EfX227UjkLGnR5aBFr-JZRrh6crbfnGV1.iOuA4I9BHJkHB5A8 PDF Slides:http://site.ieee.org/miami/files/2021/03/Volakis-Wearable-Miami-share.pdf Link to details… Read more
Micro-transfer printed ultra-thin chips for 3D IC Heterogenous Integration
Speaker:Bob ConnerVP of Business Development of X-CeleprintWhen March 16, 2021 4:00 PM Eastern Time (US and Canada) Micro-Transfer Printing (MTP) is a massively parallel liftoff and transfer process that improves… Read more
Future City 2021
FUTURECITY, SOUTH FLORIDA REGIONREGIONAL FINALS – February 13th, 2021 Future City is a national competition in which groups of middle school students present their idea of what a city would look… Read more