Speaker:
Ravi Mahajan
Director of Pathfinding for Assembly and Packaging Technologies
Technology and Manufacturing Group at Intel Corporation

When: April 22, 2021 3:00 PM Eastern Time (US and Canada)

Heterogeneous Integration (HI) is seen as a critical enabler for the progress of computing and communications in a wide variety of application environments including (but not limited to) HPC, IoT, Automotive, Networking, Medical, Aerospace etc. This talk will describe the value of packaging as an HI platform in the context of the HI Roadmap, an effort co-sponsored by societies within IEEE and ASME and by SEMI. Different packaging architectures will be compared primarily on the basis of their physical interconnect capabilities. Key features in leading edge 2D and 3D technologies, such as EMIB, Silicon Interposer, Foveros and Co-EMIB will be described and a roadmap for their evolution will be presented. Challenges and opportunities in developing robust advanced package architectures will be discussed. The talk will conclude with a broader and more open ended discussion on how technical and personal collaborations can strengthen and drive the progress of HI.

Meeting will be recorded.
Link for this meeting: https://fiu.zoom.us/meeting/register/tJwpdeqoqzorE9O-uiRZC-uyHlnr2ouNOhQD

Flyer for Event: Link