Micro-transfer printed ultra-thin chips for 3D IC Heterogenous Integration
Speaker:
Bob Conner
VP of Business Development of X-Celeprint
When March 16, 2021 4:00 PM Eastern Time (US and Canada)
Micro-Transfer Printing (MTP) is a massively parallel liftoff and transfer process that improves the power, performance, area, cost, time-to-market and security of high-performance computing, communications, mobile, automotive, industrial, medical, and defense systems. MTP stacks ultra thin die, called x-chips, containing RF and power transistors, hardware assurance features, photonics, sensors and passive components made using different process nodes and technologies (SOI, GaAs, GaN, InP, SiGe) to create 3D ICs having a previously-unattainable level of heterogeneous integration. MTP supplements other heterogenous integration technologies used for CMOS ICs made using advanced silicon nodes but cannot integrate large numbers of 1-20 micron thick x-chips made using other process technologies.
Meeting will be recorded.
Link for Zoom Registration:
http://bit.ly/3uJjm04
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