IEEE Miami Section

IEEE

NITTO DENKO’S FLEXIBLE PACKAGING MATERIALS FOR FUTURE ELECTRONICS AND BIOELECTRONICS

 

 

DECEMBER 11, 9 AM TO 10 AM EC 2300
EIJI TOYODA*, CHIHSCHIKA TSENG+, FURUKAWA YOSHIHIRO*
*Chief Researcher, New Business Development, Corporate Tech. Center
+ Semiconductor Division, Nitto America
NITTO DENKO CORPRATION

Nitto Denko is a 100-year old large Japanese company that produces a broad variety of materials for electronic systems integration (packaging). These include flexible tapes for interconnects, functional tapes such as magnetic sheets for inductors and EMI absorbers, thermal adhesive tapes and others. These are widely utilized for various products in electronics, automobiles, housing, infrastructure, environment, and medicine, all based on Nitto’s core technologies of adhesive and coatings. In this talk, Nitto technology experts will introduce the company and discuss recent product advances and how they can impact the electronic packaging industry of the future.
Brief overview of the Nitto Group will be presented first. The second part focuses on Nitto Semiconductor Back-End Process solutions – particularly die-attach tapes. The third part focuses on high-frequency and high-permeability magnetic materials for various electronic applications such as inductors, wireless power transfer and so on. Nitto will discuss magnetic sheets and their integration with coils for inductor modules as one of the applications. Nitto has such developed high-performance flexible magnetic sheets that may also have applications in wearable and implantable biomedical electronics.

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