“3D Electromigration modeling for Advanced VLSI” by Professor Tan Cher Ming, PhD, Electronic Department, Chang Gung University, Taiwan ROC. IEEE Distinguished Lecturer.

Date:  December 15, 2022 (Thursday)
Time:  19:30 hrs till 20:30 hrs (UTC+8)
Venue:  PSDC, 1 Jalan Sultan Azlan Shah, 11900 Bayan Lepas, Penang
Google Meet:  https://meet.google.com/aei-ooyi-eoy
RSVP:  https://forms.gle/mBrAgsACznP-knadt8

All are cordially invited to attend.  Admission is FREE.  Refreshment will be served.

Abstract

Electromigration is an important failure mechanism in VLSI interconnec-tions since the inception of integrated circuits till now. The complexity of the underlying physics of electromigration is increasing as we advance in
the technology nodes, and with the current FinFET technology, electromi-gration prediction must be designed in and hence, accurate electromigra-tion prediction modeling becomes necessary. This work presents a
recently developed electromigration prediction package which provides electromigration modeling in 3D and able to incorporate temperature gra-dient and thermomechanical stress gradient in the modeling. It can also
model an entire circuit so that IC designers can apply the model to their designed circuits to optimize their design by locating the weak spots of electromigration in the layout design.

Speaker

Professor Tan Cher Ming received his Ph.D in Electrical Engineering from the University of Toronto in 1992. He has 10 years of working experiences in reliability in electronic industry before joining Nanyang Technological University (NTU) as faculty member in 1996 till 2014. He then joined Chang Gung University, Taiwan and set up a research Center on Reliability Sciences and Technologies in Taiwan and acts as Center Director.

Professor Tan is Professor in Electronic Department of Chang Gung University, Honorary Chair Professor in Ming Chi University of Technology, Taiwan.  He has published 400+ International Journal and Conference papers and giving 16 keynote talks and 70 invited talks in International Conferences and several tutorials in International Conferences.  He holds 14 patents and 1 copyright on reliability software. He has written 8 books and 5 book chapters in the field of reliability.  He is an Editor of Scientific Report, Nature Publishing Group, an Editor of IEEE TDMR, Series Editor of Springer Brief in Reliability, Editor of MDPI Applied Research, Editor of Journal of Frontier of thin film, and Associate editor of Microelectronic Reliability.  He is a member of the advisory panel of Elsevier Publishing Group.  He is also in the committee of IEEE EDS Reliability Physics and the committee of IEEE EDS Master and Ph.D fellowship selection.  He is named as the father of Reliability Science by UK Researchout.org. He is also named as top 2% scientists in the world according to Stanford University research in 2021. He is a past chair of IEEE Singapore Section, senior member of IEEE and ASQ, Distinguish Lecturer of IEEE Electronic Device Society on reliability, Founding Chair of IEEE Nanotechnology Chapter – Singapore Section, Fellow of Institute of Engineers, Singapore, and Fellow of Singapore Quality Institute, Fellow of International Association of Advanced Materials, Sweden.  He is the Founding Chair of IEEE International Conference on Nanoelectronics, General Chair of ANQ Congress 2014.  He is a recipient of IEEE Region 10 Outstanding Volunteer Award in 2011.  He was Guest Editor of International J. of Nanotechnology, Nano-research letter and Microelectronic Reliability.  He is in the reviewer board of several International Journals such as Thin Solid Film, Microelectronic Reliability, various IEEE Transactions, Reliability Engineering and System Safety etc.  He is the first individual recipient of Ishikawa-Kano Quality Award in Singapore in 2014.  He is active in providing consultation to multinational corporations on reliability.  His research interests include reliability and failure physics modeling of electronic components and systems, finite element modeling of materials degradation, statistical modeling of engineering systems, nanomaterials and devices reliability, and prognosis & health management of engineering system.  For more detail, please visit www.chermingtan.com