IEEE Dayton Section

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New Senior Members in Feb 2014

Dr. Sanjay Boddhu, Dr. Eric Heller, and Mr. Vipul Patel

 were elevated to

IEEE Senior Member

on Feb 15, 2014, at the Admission and Advancement (A&A) Review Panel in Los Angeles, California, USA. These new Senior Members are the inaugural members of the Dayton Section Senior Member class of 2014.  If you happen to see them, please congratulate them.

The next Admission and Advancement (A&A) Review Panel will take place on April 12, 2014 in Denver, Colorado, USA.  To have your application be considered for this cohort, please have your application, with resume and completed references, submitted no later than Apr 2, 2014.  If you miss the Denver Review, there are other 2014 Admission and Advancement Review Panels.


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