Subcommittees

  1. RF & THz packaging, modules & components;
  2. Co-design, optimization & modeling (high-performance passives, interconnects) ;
  3. 5G & 6G communication & radar systems;
  4. Wearable & Biomedical packaging, components & sensors;
  5. Additive manufacturing & flexing packaging
  6. System-Level Multiphysics mixed-signal co-design for high-speed & mixed-signal systems  
  7. IoT, AI & cyberphysical systems (eg wireless sensors)
 

ECTC Technical Review Committee:  High-Speed, Wireless & Components (HSWC)

ECTC Technical Review Committee Chair: Lianjun Liu [Email/NXP Semiconductors]