IEEE

Designing for Power Integrity: Status, Challenges and Opportunities May 2nd 2012

A meeting of IEEE EMC Chapter on May 2d, at EMC Corp. – 228 South St., Hopkinton. ***********************************************************************************************************

Electromagnetic Compatibility Society – 6:30PM, Thursday, May 2d – Professor Madhavan Swaminathan, John Pippin Chair in Electromagnetics School of Electrical and Computer Engineering, Director, Interconnect and Packaging Center, Georgia Institute of Technology.

Subject of presentation- Designing for Power Integrity: Status, Challenges and Opportunities

Since the mid-1990s, designers have been developing sophisticated methods for managing power integrity in packages and printed circuit boards which has had a direct impact on the signal integrity of systems. These have included items such as developing design parameters such as target impedance, developing repeatable frequency domain characterization methods, pushing the EDA vendors to improve the capability of the design tools, developing new devices such as EBGs to improve isolation, developing embedded capacitance layers to name a few. However, the designers are continuing to face challenges where the noise on the power distribution is beginning to over shadow the signals in fast switching environments arising in high speed computing systems. These challenges are often times opportunities for university research that can lead to interesting and often times innovative solutions. This talk will cover a review of the past developments in this area and will focus on the present challenges and potential solutions in the area of power delivery.

Bio of the speaker:

Madhavan Swaminathan is the John Pippin Chair in Electromagnetics in the School of Electrical and Computer Engineering (ECE) and Director of the Interconnect and Packaging Center, Georgia Tech and the Founder and CTO of E-System Design, a company focusing on the development of CAD tools for achieving signal and power integrity in integrated 3D micro and nano-systems. He is also the co-founder of Jacket Micro Devices, a company that specialized in integrated RF modules and substrates for wireless applications that was acquired by AVX Corporation. He formerly held the position of Joseph M. Pettit Professor in Electronics in ECE and Deputy Director of the NSF Microsystems Packaging Center at Georgia Tech. Prior to joining Georgia Tech, he was with IBM working on packaging for supercomputers. He is the author of more than 350 journal and conference publications, holds 27 patents, is the author of 3 book chapters, primary author and co-editor of 2 books – “Power Integrity Modeling and Design for Semiconductors and Systems”, Prentice Hall, Nov 2007 and “Introduction to System on Package”, McGraw Hill, Mar. 2008 in the field of packaging and has won several awards including the Technical Excellence Award from Semiconductor Research Corporation. He is an IEEE Fellow and serves as the Distinguished Lecturer for the IEEE EMC society for the 2012 – 2013 term. He received his M.S and PhD degrees in Electrical Engineering from Syracuse University in 1989 and 1991, respectively.

This meeting of the EMC Society will be held on Thursday, May 2 2013 at EMC Corporation, 228 South Street, Hopkinton. The technical presentation will commence at 6:30:00PM following a social hour at 6:00 PM with refreshments provided.

Directions: From Route 495 North or South take exit 21B to West Main Street. Turn left at the first traffic light west of Route 495, this is South Street. Proceed 1.6 miles on South Street, through the next two traffic lights. Turn right into the third driveway after the second light, marked with sign “228 South Street” Travel 0.2 miles to the end of the driveway and park in the lot. Check in at the Building A main entrance. Conference room 1-2 is to the left of the security front desk.

 

For more information please contact Boris Shusterman at boris.shusterman@emc.com , tel. 508-249-5020