IEM Electronic Engineering Technical Division (eETD) collaborates with The Institute of Electrical and Electronics Engineers (IEEE) Penang Joint Chapter to organize a technical talk on Overview of IC Packaging Concepts (Materials & Methods) by Dr. Sim Lim Chong. This is admission free technical talk.

Abstract of the Talk

As a result of component miniaturization, new packaging architectures has been introduced to enable higher IO counts, faster signal propagations and higher efficiency in heat transfer. This presentation is intended to share the assembly technology challenges for these packages (primarily the flip chip package and its derivatives), the associated processes which were developed and enabled to address the packaging constraints due to the dimensional scaling of the package. In short, the processes from the die prep process to the ball attach process would be shared in detailed.

Biodata of Speaker

Dr. Sim Lim Chong received his Bachelor of Applied Science in Industrial Chemistry in 2001, Master of Science and Doctor of Philosophy in Material Engineering in 2002 and 2006 respectively, all from Universiti Sains Malaysia. Dr. Sim has 11 years of experiences in the semiconductor industries upon receiving his Ph.D. He started off his career with Intel Technologies as Senior Materials Engineer, responsible for the development of new materials and processes for next generation CPU and chipset products, before assuming a management role for the epoxy module. He has also spent 2 years on relocating to Chandler Arizona for the development of a new molding technology for singulated packages to reduce warpage. At present, he is now with Bosch as the SMT Engineering Manager, responsible for the process development and equipment sustaining for 16 Surface Mount Technology (SMT) Lines. From a technical perspective, he has 2 patents with United States Patent and Trademark Office (USPTO), 12 international publications and serves as a technical committee for the distinguished IEEE EPTC conference.

Program

6.30pm – 7:00pm Registration
7.00pm – 8:30pm Technical talk on Overview of IC Packaging Concepts (Materials & Methods)
8.30 pm Round-up/Photo Session

Please register via this link
https://goo.gl/forms/qmYquiuAfrWhTF742