IEEE Technical Talk – IC & MEMS Packaging: Simulating Manufacturability, Reliability, and Performance

“IC & MEMS Packaging: Simulating Manufacturability, Reliability, and Performance” by Mr Steve Groothuis, Senior Member Technical Staff, Micron Technology, Inc., USA.

Date: May 28, 2013 (Tuesday)
Time: 7:00 pm – 9:00 pm
Venue: PSDC, ELC Foyer, 1 Jalan Sultan Azlan Shah, 11900 Bayan Lepas, Penang, Malaysia

Admission is free.  Refreshments will be provided.

Network and interact with like-minded engineers and researchers before the seminar begins.

Abstract

This talk will examine how the development of Integrated Circuit (IC) and Microelectromechanical Systems (MEMS) packaging can leverage knowledge provided by Computer-Aided engineering (CAE) simulations. The focus will be mainly on manufacturability, reliability, and performance. Placing simulation activities earlier in the development process flow will result in accelerating learning cycles and promote an early-to-market philosophy.

Speaker

Steve Groothuis is a Senior Member Technical Staff and the Thermal Mechanical Analysis Group (TMAG) leader in the Process R&D department at Micron Technology, Inc. Steve and his team are instrumental in simulating effects in memory package development, implementing Design for Manufacturability (DFM) for fab processes, and modeling wafer-level mechanics & physics. Steve joined Micron in 2000 and served in various responsibilities (i.e., Senior Packaging Engineer, Senior Device Engineer, and Technology CAD section manager).

Steve has been an IEEE member [’83], IEEE Senior Member [2006], past IEEE Electron Devices Society Chair [2006-2008], and has been actively involved in IEEE community activities in both Dallas and Boise. He has played active roles in JEDEC, the Semiconductor Research Corporation (SRC), and awarded SRC’s Mahboob Khan Outstanding Industrial Mentor award (’95). In 2011, Steve won the IEEE’s Outstanding Leadership and Professional Service Award for the IEEE Boise Section.

He holds a BS in Physics degree (cum laude) from Michigan State University and a MS in Physics degree from The University of Texas at Dallas. Steve has coauthored eight granted US Patents (in package design concepts, assembly techniques, and modeling processes), three patents pending (mainly Hybrid Memory Cube packaging), and authored over forty peer-reviewed technical articles.