IEEE Conference on Standards for Communications & Networking
18-20 September 2017 – Helsinki, Finland

Technical Program Committee

Ferran Adelantado Universitat Oberta de Catalunya Spain
Hossam Afifi Télécom SudParis, Institut Telecom France
Ramón Agüero University of Cantabria Spain
Jesus Alonso-Zarate Centre Tecnologic de Telecomunicacions de Catalunya - CTTC Spain
Angelos Antonopoulos Telecommunications Technological Centre of Catalonia (CTTC) Spain
Gopalasingham Aravinthan Nokia Bell Labs France
Ioannis Askoxylakis FORTH-ICS Greece
Chadi Assi Concordia University Canada
Wassim Atoui Télécom SudParis France
Stefan Aust NEC Communication Systems, Ltd. Japan
Ahmad Awada Nokia Bell Labs Germany
Miloud Bagaa Aalto University, School of Electrical Engineering Finland
Paolo Bellavista University of Bologna Italy
Sana Ben Jemaa Orange Labs France
Ankit Bhamri Panasonic Germany
Vimal Bhatia Indian Institute of Technology Indore India
Fernando Boavida University of Coimbra Portugal
Luciano Bononi University of Bologna Italy
Michael Bredel University of Applied Sciences Darmstadt Germany
Glaucio Carvalho Ryerson University Canada
Arvind Chakrapani Qualcomm USA
Periklis Chatzimisios Alexander TEI of Thessaloniki and Bournemouth University Greece
Soumaya Cherkaoui Université de Sherbrooke Canada
Luca Cominardi Universidad Carlos III Spain
Paul Congdon University of California, Davis USA
Daniel Corujo Instituto de Telecomunicações Aveiro Portugal
Salvatore D'Oro Northeastern University USA
Tasos Dagiuklas London South Bank University United Kingdom (Great Britain)
Soumya Kanti Datta EURECOM France
Antonio de la Oliva Universidad Carlos III de Madrid Spain
Panagiotis Demestichas WINGS ICT Solutions Greece
Spyros Denazis University of Patras Greece
Marco Di Girolamo Hewlett Packard Enterprise Italy
Marco Di Renzo Paris-Saclay University / CNRS France
Aaron Yi Ding Delft University of Technology The Netherlands
Rui Dinis Faculdade de Ciências e Tecnologia, University Nova de Lisboa Portugal
Ruchen Duan Samsung Semiconductor Inc. USA
Walter Featherstone Viavi Solutions United Kingdom (Great Britain)
Bohao Feng Beijing Jiaotong Unviersity P.R. China
Miltiades Filippou Intel Germany GmbH Germany
Fotis Foukalas Technical University of Denmark Denmark
Pantelis Frangoudis EURECOM France
Valerio Frascolla Intel Deutschland Gmbh Germany
Vasilis Friderikos King's College London United Kingdom (Great Britain)
Alex Galis University College London United Kingdom (Great Britain)
Andreas Georgakopoulos WINGS ICT Solutions/ Incelligent Greece
Alireza Ghasempour ICT Faculty USA
Fabio Giust Athonet S. r. l. Italy
David Gomez-Barquero Universitat Politecnica de Valencia Spain
Stéphane Gosselin Orange Labs France
Marco Gramaglia Universidad Carlos III de Madrid Spain
Imen Grida Ben Yahia Orange Labs France
Antonio Guerrieri ICAR-CNR Italy
Andrei Gurtov Linköping University Sweden
David Gutierrez-Estevez Samsung Electronics United Kingdom (Great Britain)
Evangelos Haleplidis University of Patras Greece
Ridha Hamila Qatar University Qatar
Abdelkrim Hebbar NOKIA Bell Labs France
Syed Husain DOCOMO Labs USA
Muhammad Ali Imran University of Glasgow United Kingdom (Great Britain)
Amir H Jafari Samsung Research America USA
Ajith Jose Indian Institute of Space Science and Technology India
Athanasios Kakarountas University of Thessaly Greece
Alexandros Kaloxylos University of Peloponnese Greece
Kostas Katsalis HUAWEI Germany
Konstantinos Katsaros Digital Catapult United Kingdom (Great Britain)
Konstantinos Katsaros Intracom S.A. Telecom Solutions Greece
Lyes Khoukhi University of Technology of Troyes France
Daniel King Lancaster University United Kingdom (Great Britain)
Yuki Koizumi Osaka University Japan
Val Kosta University of Surrey United Kingdom (Great Britain)
Apostolos Kousaridas Huawei Technologies Germany
Geir Køien University of Agder Norway
Michal Krol University College London France
Adlen Ksentini Eurecom France
Sarvesh Kulkarni Villanova University USA
Nikhil Kundargi National Instruments USA
Abderrahmane Lakas UAE University United Arab Emirates
Filipe Leitão FLeitao(dot)ORG Germany
Jian Li University of Massachusetts Amherst USA
Shao-Yu Lien National Chung Cheng University Taiwan
Kai Lin Dalian University of Technology P.R. China
Mir Muhammad Lodro Sukkur IBA Pakistan
Diego Lopez Telefonica I+D Spain
Valeria Loscrí Inria Lille-Nord Europe France
Helka-Liina Määttänen Ericsson Finland
Kashif Mahmood Telenor Norway
Toktam Mahmoodi King's College London United Kingdom (Great Britain)
Lefteris Mamatas University of Macedonia Greece
Nitin Mangalvedhe Nokia Bell Labs USA
Simone Mangiante Vodafone United Kingdom (Great Britain)
Marco Manso PARTICLE Ltd. Portugal
Nader Mbarek LE2I, University of Burgundy France
Natarajan Meghanathan Jackson State University USA
Saket Mengle DataXu USA
Fabrizio Messina University of Catania Italy
Diomidis Michalopoulos Nokia Bell Labs Germany
Anukram Mishra Genus Power Infrastructures Ltd, Jaipur India
Nathalie Mitton Inria Lille - Nord Europe France
Hassine Moungla University of Paris Descartes France
Alain Mourad Interdigital Europe Ltd United Kingdom (Great Britain)
Shahid Mumtaz Instituto de Telecomunicações Portugal
Daniele Munaretto Athonet Italy
Enrico Natalizio Université de Lorraine France
Sotiris Nikoletseas University of Patras and Computer Technology Institute Greece
Boubakr Nour Beijing Institute of Technology P.R. China
Yoshiaki Ohta Fujitsu Laboratories Ltd. Japan
Abdelkader Outtagart Nokia Bell Labs France
Abdelkader Outtagarts Alcatel-Lucent bell Labs France France
Pasquale Pace University of Calabria Italy
Maria Rita Palattella Luxembourg Institute of Science and Technology (LIST) Luxembourg
Georgios Papadopoulos IMT Atlantique France
Dimitrios Pezaros University of Glasgow United Kingdom (Great Britain)
Ioannis Psaras University College London United Kingdom (Great Britain)
Guy Pujolle Sorbonne University France
Abderrezak Rachedi University Paris-Est Marne-la-Vallée France
Omer Rana Cardiff University United Kingdom (Great Britain)
Imed Romdhani Edinburgh Napier University United Kingdom (Great Britain)
Marco Ruffini CONNECT, Trinity College Dublin Ireland
Dario Sabella Intel Germany
Konstantinos Samdanis Huawei Germany
José Sánchez Orange Labs France
Maria Isabel Sanchez Bueno Simula Research Laboratory Norway
Claudio Savaglio University of Calabria Italy
Vincenzo Sciancalepore NEC Laboratories Europe GmbH Germany
Stefano Secci Sorbonne Université France
Mehrdad Shariat Samsung R&D Institute UK United Kingdom (Great Britain)
Mei-Ju Shih Hon Hai Technology Group Taiwan
Rudraksh Shrivastava Nokia Bell Labs Germany
Aman Singh Palindrome Technologies USA
Rahul Sinha TCS Research and Innovation India
JaeSeung Song Sejong University Korea
Vasilis Sourlas ICCS-NTUA Greece
Borching Su National Taiwan University Taiwan
Tarik Taleb Aalto University Finland
Argyrios Tasiopoulos University College London United Kingdom (Great Britain)
Wouter Tavernier Ghent University - imec Belgium
Milos Tesanovic Samsung Electronics R&D Institute UK United Kingdom (Great Britain)
Gia Khanh Tran Tokyo Institute of Technology Japan
Tuan Tran EXPWAY France
Riccardo Trivisonno Huawei Technologies Germany
Hua-Lung Tsai Industrial Technology Research Institute Taiwan
Tariq Umer COMSATS University Islamabad Wah Campus Pakistan
Venkatkumar Venkatasubramanian Nokia Poland
Alexandru Vulpe University Politehnica of Bucharest Romania
Jingjing Wang Tsinghua University, Beijing P.R. China
Ning Wang University of Surrey United Kingdom (Great Britain)
Wei Wei Xi'an University of Technology P.R. China
Osman N. C. Yilmaz Ericsson Research Finland
Lei Zhang University of Glasgow United Kingdom (Great Britain)
Dimitrios Zorbas Tyndall National Institute Ireland